SEMICON Southeast Asia 2016: Connecting in Penang

By Art Paredes, SEMI

Nearly 5,000 visitors and exhibitor personnel assembled in Penang last month for SEMICON Southeast Asia 2016, the largest trade show for the electronics manufacturing supply chain in the region. This year’s event featured over 80 speakers and 200 companies participating, with exhibiting companies from countries spanning the globe.

In its second year in Penang, SEMICON Southeast Asia serves as the primary platform for semiconductor equipment and materials manufacturing, assembly, test & packaging services, electronic manufacturing services (EMS), smart manufacturing technologies, and industrial IoT applications.

“With more programs and speakers this year – and the increased number of exhibiting companies, we are extremely pleased with the continued growth of SEMICON Southeast Asia,” stated Kai Fai Ng, president of SEMI Southeast Asia. Mr. Ng also stated: “the support and leadership of our Regional Advisory Board, chaired by Mr. KC Ang, senior vice president and GM of GLOBALFOUNDRIES – and the Southeast Asia Technical Committees, chaired by Mr. Nelson Wong, VP of the Ball Bonder Business Unit at Kulicke & Soffa, was greatly appreciated – and a key reason for our success.”

In addition to the sold-out exhibition hall, SEMICON Southeast Asia presented more than 90 targeted sessions and panel discussions. Key programs included the Market Trends Briefing, Supply Chain in High Tech Industry Forum, Advanced Packaging Forum, Technology Innovation Forum, Product & System Testing Forum, Sustainable Manufacturing Forum, Electrical Fault Isolation Tutorial, LED Technology Forum, and the IC Failure Analysis & Yield Productivity Forum.

Each program featured excellent speakers from the extended electronics supply chain, including KL Bock, VP of Manufacturing at SanDisk; John Galang, SEA regional director, Global Manufacturing Operations at Cisco Systems; Yohei “Fred” Sato, director ATS Marketing at TEL; Mr. CS Tan, Group VP & GM at ST Microelectronics; Ms. Fariba Abhari, director of Marketing IoT/MEMS Business Group at Lam Research; Dr. Poh Leng Eu, head of Package Innovation at NXP; Dr. Shang Yang, senior R&D Applications engineer at Advantest; Mr. Arvind Sundarrajan, head of Asia Product Development Centre at Applied Materials and; Mr. Dennis Wee, Product Engineering manager at Broadcom, to name a few.

Sold out exhibition hall

SEMICON Southeast Asia’s exhibition grew an additional 12 percent over 2015. The show floor featured many leading equipment and materials manufacturers, assembly, test & packaging providers, electronic manufacturing service (EMS) providers, and numerous suppliers from the electronics supply chain. A sample of exhibiting companies included: Advantest, DAS, DISCO, Faeth, GE Sensing & Inspection, Hermes-Epiteck, Hitachi Power Solutions, Hiwin, Lam Research, SCREEN, Surplus Global, Tokyo Electron, ULVAC, UST Technology, Yaskawa, and ZMC Technologies, to name a few. Key pavilions from Singapore, Silicon Saxony and the Malaysia Investment & Development Agency (MIDA) were also present on the show floor.

Over 200 industry leaders gathered on the summit of Penang Hill (also known as Bukit Bendera) for the annual SEMICON Southeast Asia networking event, hosted by InvestPenang. Lush gardens, live music, cooler temperatures, and fantastic views of Georgetown and mainland Penang provided the ideal backdrop for an entertaining and memorable evening.

“SEMICON Southeast Asia plays a vital role for the local economy and the continued growth of the electrical & electronics industry in Penang and throughout Malaysia,” stated Ms. Lee Lian Loo, GM of InvestPenang. “We are pleased to partner with SEMI for this outstanding trade show.”

Southeast Asia Remains a Key Market

Southeast Asia continues to play a vital role in the global IC industry and accounts for more than 27 percent of the world’s assembly, packaging and test production – and is the single largest market for packaging materials and equipment.

Dan Tracy, senior director, Industry Research & Statistics at SEMI, speaking at the Market Trends Briefing, provided a summary of year-to-date trends and a comprehensive market outlook for the global semiconductor equipment and materials market. Tracy emphasized the importance and relevance of the Southeast Asia market and the expected continuing growth in the materials and equipment sectors. According to the SEMI Materials Market Data Subscription (April 2016), Southeast Asia will account for approximately 24 percent of the total semiconductor packaging materials markets and about 14 percent of the regional fab materials market.

For more information regarding SEMICON Southeast Asia, please visit or contact Ms. Shannen Koh at For additional information on SEMI’s global expositions, please visit or contact Mr. Art Paredes @


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...