Brite Semiconductor and Semitech Semiconductor collaborate on industrial M2M SoC

Brite Semiconductor, Inc.(Brite), an ASIC/SoC design and turnkey solution provider, today announced the collaborative development of an industrial machine-to-machine (M2M) system on chip (SoC) with Semitech Semiconductor, a provider of power line communications (PLC) solutions that enable the transformation of the electricity grid into a smart grid. This SoC is designed to support M2M communication in the global industrial and energy transmission market via PLC/wireless modes.

Backed by a successful track record that includes numerous ASIC designs, Brite has developed a Cadence Tensilica-based communication core architecture SoC that integrates DSP, memory, PLC AFE, RF transceiver and high-speed interface IPs with DDR and USB. This provides a market-defining dual-mode PLC/wireless communication system to achieve interactive M2M communication. This SoC will be manufactured using an advanced process with strategic partner SMIC, and will contain Semitech’s integrated PLC/wireless IP. The resulting product will provide high reliability and quality, ensuring it can be adopted by a broad range of industrial applications.

Semitech develops a dual-mode communication core (DMCC) for PLC/wireless and will apply this IP to Brite’s SoC-based system. By leveraging its abundant experience in M2M communication and expanding its proven PLC core, Semitech provides a total DMCC solution (including architecture, digital modules and algorithms) that can simultaneously support reliable wireless and PLC connectivity for the M2M market.

“This collaboration represents an important milestone for Brite, as designing an industrial SoC product for the emerging M2M market has been a goal of ours,” said Jerry Ardizzone, senior vice president of worldwide sales and marketing for Brite Semiconductor. “The primary application for the Brite and Semitech collaboration will be smart meters, and we will develop additional solutions for broader industrial applications including smart home, smart grid and automotive.”

“The next evolutionary step for smart grid applications is to move toward heterogeneous PLC/wireless networks, while accommodating aggressive cost and power budgets,” noted Zeev Collin, CEO of Semitech Semiconductor. “Our existing PLC architecture and the extensive experience of our team in narrowband communication across different media make it possible to take this step. Partnering with Brite puts us at the leading edge of the M2M market and will ensure that we yield a superior product.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...