A*STAR’s Institute of Microelectronics (IME) has launched two consortia on advanced packaging, the Silicon Photonics Packaging consortium (Phase II) and the MEMS Wafer Level Chip Scale Packaging (WLCSP) consortium. They will develop novel solutions in the heterogeneous integration of micro-electromechanical systems (MEMS) and silicon photonics devices, which will boost overall performance and drive down production costs. The new consortia will leverage on IME’s expertise in MEMS design, fabrication, wafer level packaging process, as well as silicon photonics packaging modules and processes.
The proliferation of the Internet of Things (IoT) is driving the rapid growth of diversified technologies which are key enablers in major application domains such as smart phones, tablets, wearable technology; and network infrastructures that support wireless communications.
However, this trend requires the complex integration of non-digital functions of “More-than-Moore” technologies such as MEMS with digital components into compact systems that have a smaller form factor, higher power efficiency and cost less. The onset of big data, cloud computing and high speed broadband wireless communications also calls for novel use of silicon photonics. Silicon photonics are a critical enabler of high density interconnects and high bandwidth, to meet high optical network requirements cost-effectively.
In the previous Silicon Photonics Packaging Consortium (Phase I), IME and its industry partners developed new capabilities in necessary device library and associated tool boxes to enable the integration of low profile lateral fiber assembly, laser diode and photonics devices. By employing a laser welding technique, the consortium demonstrated a fiber-chip-fiber loss of less than 8 decibel (dB) with less than 1.5dB excess packaging loss. These capabilities enabled integrated silicon photonic circuits to provide higher data rates at lower cost and power consumption. For details, please refer to Annex A.
Building on these achievements, the Silicon Photonics Packaging Consortium (Phase II) will develop a broad spectrum of silicon photonics packaging methodology. The consortium will further develop low loss silicon coupling modules, and provide a series of packaging solutions for laser diode integration. It will also focus on developing accurate thermal models, as well as improve overall module thermal management, reliability and radio-frequency (RF) performance to meet very high data bandwidth demand. All these new developments will lead to a more integrated packaging solution which promises better assembly margins and lower module costs.
IME’s MEMS WLCSP Consortium has also been established to develop a cost- effective integration packaging platform for capped MEMS and complementary metal-oxide semiconductor (CMOS) devices. This platform could be used for any MEMS devices with cavity-capping such as timing devices, inertial sensors, and RF MEMS packaging.
Conventional chip stacking that relies on a through-silicon via (TSV) and wire bonding on substrate method will usually result in high costs and large form factor. The consortium aims to lower production costs and achieve smaller footprint by developing a TSV-free over-mold wafer level packaging solution for MEMS-capped wafer using a novel metal deposited silicon pillar and wire bonding as a through mold interconnects.
The consortium aims to reduce form factor of integrated MEMS and CMOS devices by approximately 20 per cent, and lower manufacturing costs by approximately 15 per cent. These cost-effective packaging solutions are also expected to produce better electrical and reliability performance.
“These consortia partnerships play a critical role in developing innovative solutions to meet emerging market demands. Through these collaborations, we will elevate our capabilities from developing MEMS and silicon photonics devices to developing advanced solutions in heterogeneous integration. The capabilities developed will enable our industry partners to capture new growth opportunities in the IoT space and accelerate market adoption of cost-effective technologies,” said Prof. Dim-Lee Kwong, Executive Director of IME.
“Silicon photonics packaging is a crucial technology for the commercialisation of silicon photonic devices. The partnership generated remarkable results in the Silicon Photonics Packaging Consortium Phase I, and we are pleased to continue with the second phase, which will expand the application of silicon photonics with innovative approaches in terms of LD integration and RF performance. Through this consortium, Fujikura will accelerate the development of compact and cost-effective optical communications for diverse markets,” said Mr. Kenji Nishide, Executive Officer, General Manager, Advanced Technology Laboratory, Fujikura Ltd.
“Currently, it is anticipated that the demand for sensors will grow from billions to trillions by 2050. This demand is being driven by the emergence of sensor based smart systems fusing computing, connectivity and sensing in the context of the Internet of Things. IME’s packaging consortia partnership will allow us to identify and develop MEMS packaging innovative solutions in order to scale up for the Internet of Things,” said Mr. Mo Maghsoudnia, Vice President of Technology and Worldwide Manufacturing of InvenSense.
Mr. Shim Il Kwon, Chief Technology Officer, STATS ChipPAC said, “As the number of MEMS devices in emerging IoT applications continues to grow, semiconductor packaging will have a significant impact on the performance, size and cost targets that can be achieved. By collaborating with partners in the consortia, we will be able to help drive the cost effective integration of MEMS and ￼ASICs in high performance, high yield WLCSP solutions for IoT products.”