New In-Line & Non-Destructive Hybrid Technology for Semiconductor Metrology

XwinSys recently launched the ONYX – a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry.

The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms:

  • Metal film stacks thickness measurements
  • Feature dimensions measuring
  • Detection and analysis of voids or missing layers
  • XRF thickness standards verification
  • Detecting specific miss-processing out of a multi-variable metrology application
  • Algorithm compensation for parameter variations of a film stack
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XwinSys Technology Development Ltd.


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