Toshiba debuts new technology, highlights latest memory and storage products at Flash Memory Summit

Toshiba America Electronic Components, Inc. (TAEC) will be on hand at the Flash Memory Summit (FMS) this week to showcase its latest memory and storage solutions. The inventor and one of the world’s largest producers of NAND flash, Toshiba will leverage FMS as a stage to highlight key technologies, including its BiCS FLASH 64-layer, 256Gb 3D flash memory – and to debut an all-flash solution for big data analytics. The company will also give one of the Summit’s keynote presentations. In keeping with this year’s FMS theme of high density NAND flash memory for vertical applications, Toshiba will focus on the needs of the enterprise, data center, automotive, industrial, mobile and client markets. Toshiba will be located in its theater-style booth (#407) on the show floor at the Santa Clara Convention Center from August 9-11.

Toshiba’s Shigeo (Jeff) Ohshima, technology executive, SSD, and Yoichiro Tanaka, senior fellow, will jointly present a keynote session titled: “New 3D Flash Technologies Offer Both Low Cost and Low Power Solutions.” Taking place on Tuesday, August 9 from noon – 12:30 p.m., the session will focus on the need for multiple 3D technologies to support today’s new flash applications. Emphasis will be placed on the data-intensive tasks such as real-time analytics, computational genomics, cloud computing, and video and image processing that are driving the need for high-density, low-cost solutions.

3D Flash Memory: Toshiba Continues to Lead the Way
Toshiba’s 3D flash memory solution, BiCS FLASH, will play a prominent role this year at FMS. Based on Toshiba’s cutting-edge stacking process, 3D BiCS FLASH makes larger capacities possible for enterprise applications, surpassing the capacity of mainstream two dimensional NAND flash memory while enhancing reliability and endurance and boosting performance.

With samples now shipping, Toshiba’s 64-layer 3D flash memory builds on the company’s reputation as leaders in this space – Toshiba was the first to introduce 48-layer 3D flash memory, which it debuted in March of last year. Underlining this commitment to next-generation memory solutions and furthering its momentum in the market, Toshiba recently celebrated the opening of its new Fab 2. This new semiconductor fabrication facility is dedicated to the production of its 3D flash memory solutions.

Additionally, Toshiba will showcase its new BG series solid state drive (SSD) family. Toshiba’s new single-package ball grid array (BGA) NVMe PCI Express (PCIe) Gen3 x2 SSD features BiCS FLASH deploying 3-bit-per-cell (TLC) technology, and utilizes an in-house Toshiba-developed controller and firmware for a fully vertically developed solution. This helps to ensure that the technology is tightly integrated for optimal performance, power consumption and reliability.

Flashmatrix Revealed and More
FMS will mark the debut of Toshiba’s new, all-flash, big data analytic platform technology: Flashmatrix. This platform represents a new breed of superconverged infrastructure that features integrated compute, storage and network elements optimized for high performance. This makes it suited for hybrid cloud architectures and edge-based applications that require highly distributed analytic capabilities. Flashmatrix will be demoed in the Toshiba booth.

The recently launched OCZ RD400 NVM Express® M.2 SSD Series will also be demoed at the Toshiba booth, running live in an ORIGIN PC MILLENNIUM desktop. The RD400 Series outperforms SATA SSDs by more than 4.5 times in sequential read (up to 2,600MB/s), and more than 3 times in sequential write performance (up to 1,600MB/s), increasing storage bandwidth for data-intensive workloads. ORIGIN PC is currently leveraging the performance of RD400 1024GB SSDs in several system configurations to provide ample storage capacity for custom gaming and professional PC builds.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *


KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...