Ultratech receives ‘Outstanding Supplier Award’ from SJ Semiconductor

Ultratech, Inc. (Nasdaq: UTEK), a supplier of lithography, laser­ processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today announced that it has received an ‘Outstanding Supplier Award’ from SJ Semiconductor Corp. Based in China, SJ Semiconductor is a pure play Middle-End-Of-Line (MEOL) semiconductor foundry house specializing in advanced wafer-level packaging. The award was presented to Ultratech by SJ Semiconductor CEO Cui Dong on July 27, at the company’s ‘Phase-I Mass Production, Outstanding Supplier Event’ at their facility in China. This award is further validation of Ultratech’s market leadership position in the advanced packaging lithography segment.

Rezwan Lateef, Ultratech’s General Manager and Vice President of Lithography Products, stated, “Ultratech has maintained its market leadership in the advanced packaging lithography segment by offering superior on-wafer results with industry leading cost-of-ownership and reliability in high-volume manufacturing environments. In recent years, Ultratech has expanded its presence in China, both in personnel and infrastructure, to support the burgeoning Chinese OSAT market. Ultratech believes that the SJ Semiconductor ‘Outstanding Supplier Award’ is a validation of our efforts in this region. We look forward to our continued partnership and to working closely with this valued customer to meet their future production and technology requirements.”

Ultratech is a supplier of lithography steppers for advanced packaging applications that include traditional copper pillar and wafer-level packaging (WLP), as well as the more advanced fan-out WLP and 3D ICs. The AP300 family of lithography systems is built on Ultratech’s customizable Unity Platform, delivering superior overlay, resolution and side wall profile performance while enabling cost-effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech’s award winning dual-side alignment (DSA) system, utilized around the world in volume production.


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