ASMC 2017 “Call for Papers” deadline is October 17

SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.  ASMC, which takes place May 15-18, 2017 in Saratoga Springs, New York, will feature technical presentations of more than 90+ peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, as well as educational tutorials.

ASMC, in its 28th year, continues to fill a critical need in our industry and provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts.  Selected speakers have the opportunity to present in front of IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. In addition to publication in the ASMC proceedings, select papers will be invited to participate in a special section of ASMC 2017 to be featured in IEEE Transactions on Semiconductor ManufacturingTechnical abstracts are due October 17, 2016. 

This year SEMI ( is including two new technology areas (3D/TSV/Interposer; Fabless Experience). SEMI is soliciting technical abstracts in these key technology areas:

  • Packaging and Through Silicon Via (3D/TSV)
  • Fabless Experience (FE)
  • Advanced Equipment Processes and Materials (AEPM)
  • Advanced Metrology
  • Advanced Patterning / Design for Manufacturability (AP/DFM)
  • Advanced Process Control (APC)
  • Contamination Free Manufacturing (CFM)
  • Defect Inspection and Reduction (DI)
  • Data Management and Data Mining Tools (DM)
  • Discrete Power Devices (DP)
  • Equipment Reliability and Productivity Enhancements (ER)
  • Enabling Technologies and Innovative Devices (ET/ID)
  • Factory Automation (FA)
  • Green Factory (GF)
  • Industrial Engineering (IE)
  • Lean Manufacturing (LM)
  • MOL and Junction Interfaces (MJ)
  • Smart Manufacturing (SM)
  • Yield Methodologies (YM)

Complete descriptions of each topic and author kit can be accessed at  If you would like to learn more about the conference and the selection process, please contact Margaret Kindling at or call 1.202.393.5552.

Papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged.  To submit an abstract, click here.

Technical abstracts are due October 17, 2016.  To learn more about the SEMI Advanced Semiconductor Manufacturing Conference, visit


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