SCREEN Semiconductor Solutions and Axcelis Technologies announce distribution and support agreement

SCREEN Semiconductor Solutions, a subsidiary of SCREEN Holdings Co., Ltd (TSE: 7735), with strong semiconductor equipment sales and service bases in Japan, and Axcelis Technologies, Inc. (Nasdaq: ACLS), a supplier of innovative, high-productivity solutions for the semiconductor industry, today announced a strategic agreement for distribution and support of Axcelis’ complete Purion ion implant product line in Japan. Under the agreement, the companies will establish a training and demonstration facility at SCREEN’s Process Technology Center in Hikone, Japan, as well as initiate a technical collaboration focused on developing advanced process technology for emerging implant, thermal processing and wafer cleaning applications.

Tadahiro Suhara, representative director president of SCREEN Semiconductor Solutions, commented, “We are very excited to introduce the Purion platform’s advanced ion implant technology to our Japanese customers, as well as the opportunity to leverage our combined strengths to develop next generation thermal processing capabilities through our technical collaboration. This agreement will allow us to continue to offer our customers a diversity of solutions to meet our customers’ evolving technological needs.”

Mary Puma, president and CEO of Axcelis Technologies, said, “We’re very pleased to announce our partnership with SCREEN Semiconductor Solutions, a company widely recognized for superior technology and customer satisfaction. It will enable us to bring our Purion product line to the Japan market, and provide us with strong opportunities for new customer penetrations and market share gains.”

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...