SEMICON West adds WT | Wearable Technologies Conference co-location

SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco. The electronics industry’s premier U.S. event, SEMICON West — July 10-12 at Moscone North and South — will highlight engines of industry expansion including smart transportation, smart manufacturing, smart medtech, smart data, big data, artificial intelligence, blockchain and the Internet of Things (IoT). Click here to register.

“We are excited that the WT | Wearables Technologies Conference has joined SEMICON West to co-locate in 2018,” said David Anderson, president of SEMI Americas. “Our strategic partnership brings new content and more value to our extended supply chain. Every day the semiconductor industry makes chips smaller and faster with ever-higher performance. These innovations enable new wearable applications for smart living, smart medtech and healthcare that are continuously improving our lives. The WT | Wearable Technologies Conference speakers at SEMICON West 2018 will demonstrate just how they use semiconductor technology to deliver leading-edge wearables.”

“It is a great pleasure to collaborate with the leading global electronics manufacturing association and its successful SEMICON West event,” said Christian Stammel, CEO of WT | Wearables Technologies. “Since the beginning of our platform in 2006, the semiconductor industry has been a major driver of wearables and IoT innovation. All major developments in the WT application markets like healthcare (smart patches), safety and security (tracking solutions), lifestyle and sport (smartwatches and wristbands) and in the industrial field (AR / VR) were driven by semiconductor and MEMS innovations. Our program of expert speakers at SEMICON West will share the latest insights in the wearables market as the SEMI and WT ecosystems explore collaboration and innovation opportunities.”

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