Keysight delivers the industry’s smallest solder-in probe head for high performance oscilloscopes

Keysight Technologies, Inc. (NYSE: KEYS), a technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, announced the Keysight MX0100A InfiniiMax micro probe head, the industry’s smallest solder-in probe head for high performance oscilloscopes, optimized for modern high-speed devices.

The size of electronic devices continues to shrink, resulting in smaller pads and narrower pitch spacing. Additionally, as data rates for applications such as DDR memory increase, conventional probing pads work as a stub, becoming a source for electromagnetic interference (EMI). As a result, customers are actively seeking high density, small geometry solutions for probing modern electronic technologies to analyze and measure signals without interference.

Keysight’s new InfiniiMax micro probe head is a micro solder-in head for use with the company’s InfiniiMax I/II probe amplifiers and is designed to access small geometry target devices. The lead wires can be adjusted to accommodate targets from 0 mm to 7 mm apart. When used in conjunction with Keysight’s 1169B 12 GHz InfiniiMax II probe amplifier, the MX0100A delivers up to full 12 GHz bandwidth. Offering the best probe loading performance in its class (0.17 pF, 50 kΩ differentially), the extremely low input capacitance of the MX0100A minimizes the probe loading effect and maximizes signal integrity when measuring high-speed signals.

“Existing oscilloscope probe head solutions available today are even larger than the devices being tested in some cases. This makes signal probing access a continual challenge for modern electronic technologies,” said Dave Cipriani, Vice President of the Digital and Photonics Center of Excellence at Keysight Technologies. “Unlike conventional solder-in probe heads in this class, Keysight specifically designed this micro probe to be less than half the size of existing solder-in probe heads for high density, fine pitch devices. It is the first, and only, of its kind on the market today.”

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