Cadence recognized with four 2018 TSMC Partner of the Year awards

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it has received four TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for the joint development of the 5nm design infrastructure, the cloud-based TSMC OIP Virtual Design Environment (VDE), the Wafer-on-Wafer (WoW) design solution, and its Tensilica® DSP IP.

These awards were given to Cadence based on the following work that has been delivered:

  • 5nm design infrastructure: Cadence participated in an early, in-depth collaboration with TSMC on the design infrastructure development of this latest advanced-node technology for next-generation system-on-chip (SoC) designs.
  • Cloud-based TSMC OIP VDE: Cadence was one of the first TSMC OIP Cloud Alliance partners and has collaborated with TSMC and mutual customers on successful tapeouts.
  • WoW design solution: Cadence collaborated with TSMC on the development of a design solution and delivered a reference flow that includes implementation, electrical analysis and physical verification
  • DSP IP: Cadence collaborated with TSMC on the delivery of Cadence® Tensilica DSP IP, the most widely-used DSP IP in the TSMC portfolio, which mutual customers use to complete successful projects.

“Through our ongoing collaboration with TSMC, we’ve jointly worked to stay in front of industry trends so that we can enable our mutual customers to consistently deliver successful designs through use of the latest technologies,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “These awards from TSMC exemplify our ability to drive the industry forward with our innovations with 5nm, cloud, WoW, and DSP IP.”

“Our ongoing, in-depth collaboration with Cadence provides our customers with confidence that they can use the latest technologies and tools to deliver new innovations in competitive market windows,” said Suk Lee, senior director of the Design Infrastructure Marketing Division at TSMC. “We look forward to continuing to partner together on creative new solutions that our mutual customers can use to establish leadership in their respective markets.”

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