North American semiconductor equipment industry posts December 2018 billings

North America-based manufacturers of semiconductor equipment posted $2.11 billion in billings worldwide in December 2018 (three-month average basis), according to the December Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 8.5 percent higher than the final November 2018 level of $1.94 billion, and is 12.1 percent lower than the December 2017 billings level of $2.40 billion.

“December billings of North American equipment manufacturers ended 2018 on a positive note,” said Ajit Manocha, president and CEO of SEMI. “Spending for logic and foundry offset the decline in memory investments for the month.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Billings
(3-mo. avg.)
Year-Over-Year
July 2018
$2,377.9
4.8%
August 2018
$2,236.8
2.5%
September 2018
$2,078.6
1.2%
October 2018
$2,029.2
0.5%
November 2018 (final)
$1,943.6
-5.3%
December 2018 (prelim)
$2,108.9
-12.1%

Source: SEMI (www.semi.org), January 2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

NEW PRODUCTS

Introducing Semiconductor Digest
04/30/2019Semiconductor Digest is a new magazine dedicated to the worldwide semiconductor industry...
KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...