3D Integration

3D INTEGRATION ARTICLES



Synopsys and imec demonstrate accelerated modeling of complementary FET (CFET) technology

12/10/2018  Synopsys, Inc. announced today another milestone in its longstanding partnership with imec.

CEA-Leti moves 3D sequential integration closer to commercialization

12/04/2018  Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.

New quantum materials could take computing devices beyond the semiconductor era

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

MagnaChip to commence volume production of high-voltage IGBT products for power module

11/26/2018  MagnaChip Semiconductor announced that volume production has commenced for an IGBT product for power module targeted to high-voltage industrial applications.

Solution for next generation nanochips comes out of thin air

11/19/2018  The secret ingredient for the next generation of more powerful electronics could be air, according to new research.

MIRPHAB offering design, production and business planning for companies developing mid-infrared devices for chemical sensing and spectroscopic applications

11/14/2018  MIRPHAB, a European Commission project to create a pilot line to fabricate mid-infrared (MIR) sensors by 2020, is accepting proposals from companies that want to develop and prototype new MIR devices that operate in gas-and-liquid media.

Micron collaborates with premium German automaker to advance automotive memory technologies

11/14/2018  Micron Technology, Inc., (Nasdaq: MU) today announced at Electronica 2018 that it will collaborate with the BMW Group to further advance the development of automotive memory solutions used in vehicles.

GLOBALFOUNDRIES, indie Semiconductor deliver performance-enhanced microcontrollers for automotive applications

11/12/2018  GLOBALFOUNDRIES and indie Semiconductor today announced the release of a new generation of customized microcontrollers on GF's 55nm Low Power Extended (55LPx) automotive-qualified platform, which includes embedded non-volatile memory (SuperFlash) technology.

Semiconductor Research Corporation welcomes SK hynix to its acclaimed GRC and NST research programs

11/08/2018  SRC research focused on next-generation semiconductor technology continues to attract the world's leading semiconductor design and manufacturing companies.

Renesas Electronics announces absorption-type merger with consolidated subsidiary

10/31/2018  Renesas Electronics Corporation today announced that it has resolved at the Meeting of Board of Directors held on October 31, 2018 to consolidate its wholly-owned subsidiary Renesas Semiconductor Package & Test Solutions Co, Ltd.

Innodisk bringing the next-generation NAND flash to the industrial embedded market

10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

pSemi announces frequency extension and volume production of the 55 GHz Digital Step Attenuator (DSA)

10/30/2018  This mmWave product is the world's first single-chip silicon-on-insulator (SOI) DSA to support the entire 9 kHz to 55 GHz frequency range.

Global semiconductor sales in September up 13.8% year-to-year

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

Cadence custom/AMS flow certified on Samsung 7LPP process technology

10/24/2018  Cadence Design Systems, Inc. today announced that its custom and analog/mixed-signal (AMS) IC design tools have achieved certification for Samsung Foundry’s 7nm Low Power Plus (7LPP) process technology.

Advanced packaging technologies are key for semiconductor innovation

10/24/2018  In the era of a slowing Moore's Law, advanced packaging has emerged as the savior of future semiconductor development.

Silvaco appoints Babak Taheri as Chief Technology Officer

10/22/2018  Dr. Taheri will be taking Silvaco’s advanced positions in FinFET and beyond nodes, novel materials, emerging memory and advanced display technologies, to the next level.

Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

MagnaChip introduces high-voltage super junction MOSFET

10/15/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge.

GLOBALFOUNDRIES expands RFwave Partner Program to speed time-to-market for wireless connectivity, radar and 5G

10/11/2018  GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program.

GOWIN Semiconductor's GW1NS family of products named Arm TechCon 2018 Innovation Award finalist for design innovation of the year

10/10/2018  GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.




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WEBCASTS



FD-SOI: An Optimal Technology for Integrated IoT and 5G Designs

Thursday, December 13, 2018 at 1 p.m. Eastern

As digital-centric scaling pursues solutions in 3D device architectures such as gate-all-around (GAA) transistors, most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance. This webinar is an overview of production-proven fully-depleted silicon-on-insulator (FD-SOI), the only post-bulk planar transistor technology. We will explain and demonstrate how FD-SOI delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.

Sponsored By:
Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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