NEWS ANALYSIS & FEATURES


Qualcomm extends cash tender offer for all outstanding shares of NXP

06/15/2018  Qualcomm Incorporated has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors N.V.

Micross announces new executive appointment

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

FormFactor announces breakthrough improvements in productivity for RF probe systems

06/15/2018  FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

Synopsys IC Validator certified by Samsung Foundry for 7nm signoff physical verification

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys' IC Validator has been certified by Samsung Foundry for signoff of all designs using its 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Synopsys Fusion Technology enables lower power, high performance on Samsung Foundry 7LPP process with EUV

06/14/2018  Synopsys, Inc. (Nasdaq: SNPS) today announced that Samsung Foundry has certified the Synopsys Design Platform with Fusion Technology for 7-nanometer (nm) Low Power Plus (LPP) process with Extreme Ultraviolet (EUV) lithography technology.

Wireless technologies to comprise 55% of connectivity IC shipments in 2018

06/14/2018  Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit

Industrial internet and connected vehicles drive IoT sales through 2021​

06/14/2018  IC Market Drivers 2018 Update maintains solid revenue growth across all IoT end-use systems.

WIN Semiconductors releases new platform integrating high performance 0.1um GaAs pHEMT with monolithic PIN and vertical Schottky diodes

06/13/2018  WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, has expanded its portfolio of highly integrated GaAs technologies with the release of a new pHEMT technology.

Aledia selects Veeco Propel GaN MOCVD platform for large wafer 3D LED production

06/13/2018  Veeco Instruments Inc. has selected Veeco’s Propel GaN MOCVD system to support advanced research and development.

Plasma-Therm completes acquisition of France-based CORIAL

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

NXP introduces new high power RF products for 5G networks

06/12/2018  Company expands its Gallium Nitride (GaN) and LDMOS technology portfolios to offer a full range of high power products.

SEMI Americas and Applied Materials host media and analyst lunch briefing at SEMICON West 

06/12/2018  Sparking conversation is a goal of SEMICON West, and SEMI Americas and Applied Materials invite working journalists across the electronics spectrum to a special AI Design Forum luncheon on Tuesday, July 10, from noon to 1:30 p.m., at The Forum at the Yerba Buena Center for the Arts, 701 Mission Street, in San Francisco. The event is presented in conjunction with SEMICON West at the Moscone Center.

pSemi expands digital step attenuator portfolio with high-performance DSAs

06/12/2018  pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with a family of value, high-performance DSAs.

MEMS pressure sensor technologies: Multiple ways to success

06/11/2018  The MEMS pressure sensor market is still driven by automotive applications. Established automotive applications increase MEMS pressure sensors adoption in the integrating systems, and also widespread their geographical adoption especially in China thanks to new automotive regulation.

The MEMS market is showing a 17.5% CAGR between 2018 and 2023

06/11/2018  MEMS market will experience a 17.5% growth in value between 2018 and 2023, to reach US$ 31 billion at the end of the period.

Silicon provides means to control quantum bits for faster algorithms

06/11/2018  Research groups from Purdue University, the Technological University of Delft, Netherlands and the University of Wisconsin-Madison have discovered that silicon has unique spin-orbit interactions that can enable the manipulation of qubits using electric fields, without the need for any artificial agents.

Solar cells combining silicon with perovskite have achieved record efficiency of 25.2 percent

06/11/2018  Researchers from EPFL and CSEM have combined silicon- and perovskite-based solar cells. The resulting efficiency of 25.2 percent is a record for this type of tandem cell. Their innovative yet simple manufacturing technique could be directly integrated into existing production lines, and efficiency could eventually rise above 30 percent.

Winbond extends performance of Serial NAND Flash memory with 1Gbit device with maximum data-transfer rate of 83MB/s

06/08/2018  Winbond’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

Cree announces CFO transition plan

06/08/2018  Cree, Inc. today announced that Executive Vice President and Chief Financial Officer (CFO) Mike McDevitt will retire from his executive positions following a transition period.



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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.





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