NEWS ANALYSIS & FEATURES


Topological defects could be key to future nano-electronics

02/25/2019  Ferroic and multiferroic topological structures reviewed in Nature Materials.

Soitec joins China Mobile 5G Innovation Center

02/25/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, today announced it is the first materials supplier to join the China Mobile 5G Innovation Center.

SEMI launches initiative to build talent pipeline critical to global electronics industry growth

02/25/2019  SEMI today announced SEMI Works, a comprehensive program to attract, develop and retain the talent critical to the worldwide electronics industry's continued innovation and growth.

GOWIN Semiconductor announces release of the new GOWIN EDA tools for improved performance on new FPGA product families

02/22/2019  GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

North American semiconductor equipment industry posts January 2019 billings

02/22/2019  January billings of North American equipment manufacturers declined 10 percent when compared to the prior month.

Advances in logic IC process technology move forward

02/22/2019  Despite increasing development costs, IC manufacturers continue to make great strides.

Graphene 'sandwich' key to new electronics

02/21/2019  Lithographically carved graphene and boron nitride 'sandwich' yields outstanding electrical properties.

The holy grail of nanowire production

02/21/2019  Researchers from EPFL's Laboratory of Semiconductor Materials, run by Anna Fontcuberta i Morral, together with colleagues from MIT and the IOFFE Institute, have come up with a way of growing nanowire networks in a highly controlled and fully reproducible manner.

Physicists get thousands of semiconductor nuclei to do 'quantum dances' in unison

02/21/2019  A team of Cambridge researchers have found a way to control the sea of nuclei in semiconductor quantum dots so they can operate as a quantum memory device.

SEMI-FlexTech announces 2019 FLEXI Awards winners in flexible hybrid electronics

02/21/2019  The 2019 FLEXI Awards has recognized outstanding accomplishments in the Flexible Hybrid Electronics (FHE) industry in 2018.

UltraSoC announces support for Western Digital RISC-V SweRV Core and OmniXtend cache-coherent interconnect

02/21/2019  UltraSoC today announced full support within its embedded analytics architecture for Western Digital's RISC-V SweRV Core and associated OmniXtend cache-coherent interconnect.

POET Technologies establishes photonics design capabilities in Ottawa

02/21/2019  POET Technologies Inc. and Photonic Integrated Circuits (PICs) for the data- and tele-communication markets, today announced that it had entered into an agreement with the highly-respected firm, MillView Photonics, Inc. to establish a collaborative design center in Ottawa, Ontario, Canada.

Synopsys and GLOBALFOUNDRIES collaborate to develop industry's first automotive grade 1 IP for 22FDX process

02/21/2019  Synopsys, Inc. and GLOBALFOUNDRIES today announced a collaboration to develop a portfolio of automotive Grade 1 temperature DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator process.

pSemi announces Sumit Tomar will be transitioning to CEO

02/20/2019  pSemi Corporation today announced that its parent company and executive leadership has approved the recommendation of Chairman and Chief Executive Officer Jim Cable for an evolution of the company's senior leadership structure.

Rice U. researchers unveil Internet of Things security feature

02/20/2019  'Physically unclonable function' is 10 times more reliable than previous methods.

CEA-Leti and Stanford target edge-AI apps with breakthrough NVM memory cell

02/20/2019  Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

GLOBALFOUNDRIES crosses billion-dollar design win threshold with 8SW RF SOI technology

02/20/2019  Mobile market continues to favor RF SOI, with 8SW proving to be the industry's leading platform for power-optimized chips.

ESI receives significant Asia order for flex PCB laser via drilling solution

02/19/2019  Electro Scientific Industries (ESI), a division of MKS Instruments, Inc. and an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced an order for its recently-released CapStone laser drilling solution for processing flexible printed circuits (FPC).

GlobalFoundries and Dolphin Integration to deliver differentiated FD-SOI adaptive body bias solutions

02/19/2019  IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

Soitec and Simgui announce enhanced partnership and increased production capacity of 200mm SOI wafers in China

02/19/2019  Soitec, a designer and manufacturer of innovative semiconductor materials, and Shanghai Simgui Technology Co., Ltd., a Chinese silicon-based semiconductor materials company, jointly announced today an enhanced partnership and an increase in annual production capacity of 200mm silicon-on-insulator (SOI) wafers





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First quarter 2016 silicon wafer shipments increase quarter-over-quarter

05/17/2016  Worldwide silicon wafer area shipments increased during the first quarter 2016 when compared to fourth quarter 2015 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.





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