TOP STORIES

EDITOR’S PICKS
THE CONFAB
EDUCATION
BLOGS
Process Watch: Monitoring for excursions in automotive fabs
11/29/2018The Process Watch series explores key concepts about process control — defect inspection, metrology and data analytics — for the semiconduc…
SEMI unveils industry’s first power and compound fab outlook
11/26/2018SEMI, the global industry association serving the global electronics manufacturing supply chain, today announced the industry’s first worldw…
Global semiconductor sales increase 12.7% year-to-year in October
12/06/2018The global semiconductor industry posted solid year-to-year growth in October and is on pace for its highest-ever annual sales in 2018,…
Samsung’s big semi capex spending keeps pressure on competition
11/29/2018Samsung’s two-year capex spending of $46.8 billion nearly matches the combined two-year capex spending of $48.4 set by Intel and TSMC….
Tech Papers
Upcoming Webcasts
FD-SOI: An Optimal Technology for Integrated IoT and 5G Designs
Thursday, December 13, 2018 at 1 p.m. Eastern As digital-centric scaling pursues solutions in 3D device architectures such…
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…

MAGAZINE




BLOGS




TWITTER


NEWS ANALYSIS & FEATURES


Vertiv completes acquisition of MEMS maintenance business

12/06/2018  Vertiv announced today that it has completed the purchase of the maintenance business of MEMS Power Generation (MEMS), a privately-owned company headquartered in the United Kingdom that specializes in temporary power solutions.

Crystal clear: Understanding magnetism changes caused by crystal lattice expansion

12/06/2018  An international team including researchers from Osaka University reports the control of the complex magnetic ground states in a simple cubic crystal through careful selection of ions of different size.

Lam Research announces Martin Anstice resigns as CEO

12/06/2018  Tim Archer appointed as president and CEO.

SEMI Industry Strategy Symposium leads microelectronics into new era

12/06/2018  SEMI ISS 2019 kicks off Technology Leadership Series of the Americas.

Global demand growth for flat panel display expected to ease through 2021

12/05/2018  After hitting 7.3 percent growth in 2018, global demand for flat panel displays (FPDs) in terms of area is forecast to expand 6.4 percent to 228 million square meters in 2019. It is the first slowdown in year-on-year growth in four years.

Colloidal quantum dots make LEDs shine bright in the infrared

12/05/2018  A group of ICFO researchers report on the development of a colloidal quantum-dot light emitting diode with unprecedented quantum and power conversion efficiencies in the infrared range. The study, published in Nature Nanotechnology, has proven that these devices can also be integrated in inorganic solar cells and may lead to even higher efficiencies.

Artificial synapses made from nanowires

12/05/2018  Scientists from Jülich together with colleagues from Aachen and Turin have produced a memristive element made from nanowires that functions in much the same way as a biological nerve cell.

SEMI launches new semiconductor manufacturing workforce development campaign

12/05/2018  The semiconductor manufacturing industry is fighting to attract, educate, and retain the necessary talent for its continued growth.

CEA-Leti develops circuits for neuromorphic processors that replace CMOS transistor-based TCAM memory with RRAM-based TCAM memory

12/05/2018  Leti, a research institute at CEA Tech, has proven that RRAM-based ternary-content addressable memory (TCAM) circuits, featuring the most compact structure developed to date, can meet the performance and reliability requirements of multicore neuromorphic processors.

CEA-Leti moves 3D sequential integration closer to commercialization

12/04/2018  Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.

A new light on significantly faster computer memory devices

12/04/2018  A team of scientists from Arizona State University's School of Molecular Sciences and Germany have published in Science Advances online today an explanation of how a particular phase-change memory (PCM) material can work one thousand times faster than current flash computer memory, while being significantly more durable with respect to the number of daily read-writes.

SEMI welcomes efforts to reduce U.S.-China trade tensions

12/04/2018  The U.S. plans to delay tariff increases on $200 billion worth of Chinese imports, China has vowed to increase U.S. market access, and both parties are planning talks over the course of 90 days to address current frictions.

Global microelectronics experts develop SEMI's technology leadership series of the Americas

12/04/2018  World's largest lineup to advance industry roadmap in seven major conferences.

Silicon Labs joins Semiconductor Industry Association

12/03/2018  Silicon Labs President and CEO Tyson Tuttle elected to SIA board of directors.

New quantum materials could take computing devices beyond the semiconductor era

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

CEA-Leti and Silvaco to develop gate-all-around SPICE compact models for circuit design and tech co-optimization

12/03/2018  Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.

EVG unveils next-generation fusion wafer bonder for "More Moore" scaling and front-end processing

12/03/2018  New BONDSCALE system provides a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap.

Worldwide semiconductor equipment billings drop to $15.8B in third quarter 2018

12/03/2018  SEMI today reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11 percent higher than the same quarter a year ago.

Qualcomm launches $100M AI investment fund

11/30/2018  Qualcomm Incorporated today announced the launch of the Qualcomm Ventures AI Fund to invest up to an aggregate of $100 million in startups transforming artificial intelligence.

MORE ANALYSIS & FEATURES

RESOURCE GUIDE - Get Listed


Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



Categories


Featured Supplier


Busch Vacuum Pumps & Systems: http://www.buschusa.com
Product announcements:



VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

More Technology Papers

WEBCASTS

FD-SOI: An Optimal Technology for Integrated IoT and 5G Designs

  Thursday, December 13, 2018 at 1 p.m. Eastern

As digital-centric scaling pursues solutions in 3D device architectures such as gate-all-around (GAA) transistors, most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance. This webinar is an overview of production-proven fully-depleted silicon-on-insulator (FD-SOI), the only post-bulk planar transistor technology. We will explain and demonstrate how FD-SOI delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.

Sponsored By:
Lithography

  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


More Events

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...