Altera Corporation and Intel Corporation today announced their collaboration on the development of multi-die devices that leverage Intelâ€™s package and assembly capabilities and Alteraâ€™s leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Alteraâ€™s Stratix 10 FPGAs and SoCs using the 14nm Tri-Gate process.
Alteraâ€™s work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Alteraâ€™s heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challengesimpacting high-end applications in the communications, high-performance computing, broadcast and military segments.
Intelâ€™s 14nm Tri-Gate process density advantage and Alteraâ€™s patented FPGA redundancy technology enable Altera to deliver the industryâ€™s highest density monolithic FPGA die, offering greater integration of system components on a single die. Altera is leveraging its leadership in developing the largest monolithic FPGA die and Intelâ€™s packaging technology to integrate even more capabilities into a single system-in-a-package solution. Intelâ€™s manufacturing process is co-optimized to offer manufacturing simplicity consisting of turnkey foundry services that include the manufacturing, assembly and testing of heterogeneous multi-die devices. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.
â€śOur partnership with Altera to manufacture next-generation FPGAs and SoCs using our 14nm Tri-Gate process is going exceptionally well,â€ť said Sunit Rikhi, vice president and general manager, Intel Custom Foundry. â€śOur close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging. Together, both companies are building off one anotherâ€™s expertise with the primary focus on building industry-disrupting products.â€ť
â€śOur collaboration with Intel on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems,â€ť said Brad Howe, senior vice president of research and development at Altera Corporation. â€śLeveraging Intelâ€™s advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements.â€ť