Applications

APPLICATIONS ARTICLES



Nano-kirigami: 'Paper-cut' provides model for 3D intelligent nanofabrication

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

Next on-chip: Human organs

07/11/2018  Many new innovations were discussed at imec’s U.S. International Technology Forum (ITF) on Monday at the Grand Hyatt in San Francisco, including quantum computing, artificial intelligence, sub-3nm logic, memory computing, solid-state batteries, EUV, RF and photonics, but perhaps the most interesting was new technology that enables human cells, tissues and organs to be grown and analyzed on-chip.

The outlook for new metrology approaches

07/10/2018  To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

Proving the benefits of data analysis

07/10/2018  The semiconductor industry is collecting massive amounts of data from fab equipment and other sources. But is the trend toward using that data in a Smart Manufacturing or Industry 4.0 approach happening fast enough in what Mike Plisinski, CEO of Rudolph Technologies, calls a "very conservative" chip manufacturing sector?

Merging antenna and electronics boosts energy and spectrum efficiency

07/05/2018  Research could lead to longer talk time and higher data rates in 5G devices.

Ultimate precision for sensor technology using qubits and machine learning

07/05/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

Leti, Transdev, IRT Nanoelec announce pilot program to assess new perception sensors for autonomous vehicles

07/05/2018  Leti, a research institute at CEA Tech, Transdev, a global provider of mobility services, and IRT Nanoelec, an R&D center focused on information and communication technologies (ICT) using micro- and nanoelectronics, today announced a pilot program to characterize and assess LiDAR sensors to improve performance and safety of autonomous vehicles.

Smart devices are critical entry point to IoT ecosystem

07/03/2018  As smart functionality makes its way into homes and businesses, two devices are gaining a foothold into broader ecosystems to maximize growth and revenue opportunities: smart speakers and smart meters.

Ultimate precision for sensor technology using qubits and machine learning

07/03/2018  Extracting information quickly from quantum states is necessary for future quantum processors and super-sensitive detectors in existing technologies.

Alta Devices breaks solar energy efficiency record

07/02/2018  Alta Devices has today announced that its most recent single junction solar cell has been certified by NREL (National Renewable Energy Laboratory) as being 28.9% efficient.

New infrastructure and sensors extract actionable information from mature IoT

07/02/2018  For medtech applications to flourish, sensors need a supporting infrastructure that translates the data they harvest into actionable insights, says Qualcomm Life director of business development Gene Dantsker, who will speak about the future of digital healthcare in the Medtech program at SEMICON West.

SEMICON West: Exponential growth in data volumes drives change in system architecture

06/28/2018  With artificial intelligence (AI) rapidly evolving, look for applications like voice recognition and image recognition to get more efficient, more affordable, and far more common in a variety of products over the next few years.

Optimum Semiconductor unveils new image recognition SoC

06/26/2018  Optimum Semiconductor Technologies, Inc., a fabless semiconductor company providing highly-integrated Systems on Chips (SoCs) for China's thriving electronics markets, announced the GP8300 SoC.

Closing the gap: On the road to terahertz electronics

06/26/2018  Asymmetric plasmonic antennas deliver femtosecond pulses for fast optoelectronics.

Leti demonstrates new waveform for 5G low-power wide-area Internet of Things networks

06/25/2018  Leti, a research institute of CEA Tech, today announced that field trials of its new Low Power Wide Area (LPWA) technology, a waveform tailored for Internet of Things (IoT) applications, showed significant performance gains in coverage, data-rate flexibility and power consumption compared to leading LPWA technologies.

9 of the Top 12 smartphone suppliers headquartered in China​

06/22/2018  China accounted for 7 of top 10 leading smartphone suppliers in 2017, share grows to 42%.

U-M researchers create world's smallest 'computer'

06/21/2018  IBM's announcement that they had produced the world's smallest computer back in March raised a few eyebrows at the University of Michigan, home of the previous champion of tiny computing.

Scientists print sensors on gummi candy

06/21/2018  Printing microelectrode arrays on gelatin and other soft materials could pave the way for new medical diagnostics tools.

Executive keynotes to identify MEMS, sensors, imaging innovations and megatrends at SEMI-MSIG European Summits

06/19/2018  Industry leaders to share latest developments in smart automotive, smart cities, smart industrial, biomedical, consumer and IoT, September 19-21, 2018, in Grenoble, France.

SEMI-FlexTech invites proposals for flexible hybrid electronics advances

06/19/2018  FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors, power and other key electronic components.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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VIDEOS