Applications

APPLICATIONS ARTICLES



Leti announces EU project to develop powerful, inexpensive sensors with photonic integrated circuits

09/19/2018  Leti, a research institute of CEA Tech, today announced the launch of the REDFINCH consortium to develop the next generation of miniaturized, portable optical sensors for chemical detection in both gases and liquids.

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

09/18/2018  Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

The role of autonomous mobility in driving MEMS & sensors to $100B market

09/13/2018  MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

Sensors: From red hot chillies to patients

09/13/2018  SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.

Wearable ultrasound patch monitors blood pressure deep inside body

09/12/2018  A new wearable ultrasound patch that non-invasively monitors blood pressure in arteries deep beneath the skin could help people detect cardiovascular problems earlier on and with greater precision.

More than mobility: Smart automotive innovations go beyond technology

09/10/2018  Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a "mobility service provider"?

Sensor fusion: Enabling devices to be aware of their surroundings

09/07/2018  SEMI spoke with Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG, ahead of the European MEMS & Sensors Summit.

The future of MEMS and sensors: Beyond human senses

09/06/2018  2017 was a good year for the MEMS and sensors business, and that upward trend should continue.

Less price erosion will lift MEMS sensor/actuator growth

09/05/2018  More intelligent and automated controls and specialized MEMS-built semiconductors will keep ASPs from falling as much as they did in the last 10 years, says O-S-D report.

Leti and Vsora demonstrate 3GPP new radio on multi-core digital signal processor

09/04/2018  Leti, a research institute of CEA Tech, and VSORA, which specializes in multi-core digital signal processor (DSP) design, today announced they have demonstrated the implementation of 5G New Radio (5G NR) Release 15 on a new DSP architecture that can dramatically reduce time to market of digital modems.

SEMICON Taiwan opens with AI, IoT, automotive in the spotlight

09/04/2018  Semiconductor industry growth drivers artificial intelligence (AI), Internet of Things (IoT) and automotive take center stage as more than 45,000 visitors gather at SEMICON Taiwan starting today.

NXP acquires OmniPHY

09/04/2018  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology.

A human enzyme can biodegrade graphene

08/24/2018  Graphene Flagship partners discovered that a natural human enzyme can biodegrade graphene. These findings could have great implications in the development of graphene-based biomedical devices.

Gartner identifies five emerging technology trends that will blur the lines between human and machine

08/23/2018  The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

Samsung's Exynos i S111 delivers efficiency and reliability for NB-IoT devices

08/23/2018  New IoT solution includes modem, processor, memory and GNSS functions in one chip.

Semtech’s LoRa technology creates IoT metering solutions to improve facility management in China

08/22/2018  EasyLinkin’s LoRa-based IoT solutions gather data and analytics on utility usage.

Murata invests in MEMS sensor manufacturing in Finland

08/21/2018  Murata Manufacturing Co., Ltd. expands its MEMS sensor manufacturing by building a new factory in Vantaa, Finland to increase the sensor production capacity.

CTA study: China tariffs will cost the U.S. economy up to $2.4B annually

08/17/2018  The Trump administration's consideration of tariffs on Chinese printed circuit assemblies and connected devices would cost the economy $520.8 million and $2.4 billion annually for the 10 percent and 25 percent tariffs, respectively, according to a new study commissioned by the Consumer Technology Association (CTA).

Novel sensors could enable smarter textiles

08/17/2018  University of Delaware engineers use carbon nanotube composite coatings.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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