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Standard for fan-out panel size ready to ballot
09/05/2018The arrival of Fan-Out Panel Level Packaging (FO-PLP) appears to be at a perfect time: This technology will leverage processes developed for Three Dimens…
China’s semiconductor fab capacity to reach 20% worldwide share in 2020
09/04/2018The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity …
Top 10 semiconductor industry innovations
09/07/2018Over the past three decades, most of the world’s innovations have centered largely on business models and involved iterative advances of existing technologie…
Less price erosion will lift MEMS sensor/actuator growth
09/05/2018More intelligent and automated controls and specialized MEMS-built semiconductors will keep ASPs from falling as much as they did in the last 10…
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and…
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…

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NEWS ANALYSIS & FEATURES


Tight supplies impede LCD panel cost reduction in third quarter of 2018

09/10/2018  Tight supplies of display panel materials and components, such as driver integrated circuit (IC), glass substrate and polarizer, are expected to slow the decline rate of liquid crystal display panel costs.

Air Products to expand supply for Samsung Electronics' semiconductor fab in Giheung, South Korea

09/10/2018  Air Products today announced it has been awarded by Samsung Electronics additional gaseous nitrogen and hydrogen supply to its semiconductor fab in Giheung, South Korea.

SUTD researchers resolve a major mystery in 2D material electronics

09/10/2018  Researchers from the Singapore University of Technology and Design (SUTD) have made a major step forward in resolving the mysteries surrounding 2D material Schottky diode.

Worldwide semiconductor equipment billings reach $16.7B in second quarter 2018

09/10/2018  Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.

More than mobility: Smart automotive innovations go beyond technology

09/10/2018  Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a "mobility service provider"?

Nova's materials metrology solution selected for 5nm technology node

09/07/2018  Nova announced today that a major foundry recently placed an order for its VeraFlex advanced X-Ray metrology solution for 5nm technology node.

ASMC 2019 Call for Papers deadline is October 9, 2018

09/07/2018  Educate the industry about the latest in advanced processes and materials.

Sensor fusion: Enabling devices to be aware of their surroundings

09/07/2018  SEMI spoke with Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG, ahead of the European MEMS & Sensors Summit.

Global semiconductor sales increase 17.4% year-to-year in July

09/06/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

Industry's only worldwide OSAT manufacturing sites database now tracks 320 facilities

09/06/2018  SEMI and TechSearch International database also revises facility technology capabilities and offerings.

GLOBALFOUNDRIES CTO Gary Patton to deliver opening keynote at GSA Silicon Summit

09/06/2018   Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY. 

Researchers use silicon nanoparticles for enhancing solar cells efficiency

09/06/2018  An international research group improved perovskite solar cells efficiency by using materials with better light absorption properties.

The future of MEMS and sensors: Beyond human senses

09/06/2018  2017 was a good year for the MEMS and sensors business, and that upward trend should continue.

OEM Group introduces next-generation Spin Rinse Dryer (SRD)

09/05/2018  OEM Group announced a major engineering design upgrade of its Semitool Spin Rinse Dryer, a platform for removing residual chemicals from semiconductor substrates and other materials such as optical lenses.

Lattice Semiconductor appoints Steve Douglass as Corporate VP, R&D

09/05/2018  Lattice Semiconductor Corporation, a provider of customizable smart connectivity solutions, announced the appointment of Steve Douglass as the Company's Corporate Vice President, R&D, effective immediately.

Veeco announces changes to executive leadership team

09/05/2018  John Peeler to remain as Executive Chairman as Bill Miller becomes CEO on October 1, 2018.

SEMI Europe and AENEAS collaborate to support European electronics industry growth

09/05/2018  SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European electronics industry's growth.

Leti and Vsora demonstrate 3GPP new radio on multi-core digital signal processor

09/04/2018  Leti, a research institute of CEA Tech, and VSORA, which specializes in multi-core digital signal processor (DSP) design, today announced they have demonstrated the implementation of 5G New Radio (5G NR) Release 15 on a new DSP architecture that can dramatically reduce time to market of digital modems.

SEMICON Taiwan opens with AI, IoT, automotive in the spotlight

09/04/2018  Semiconductor industry growth drivers artificial intelligence (AI), Internet of Things (IoT) and automotive take center stage as more than 45,000 visitors gather at SEMICON Taiwan starting today.

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RESOURCE GUIDE - Get Listed


Latest Article

Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

More Technology Papers

WEBCASTS

Advanced Packaging

  Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018


More Events

NEW PRODUCTS

KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...