Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.
- Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
IFTLE 395: And Then There Were 3; IC History for the Younger Generation
By Dr. Phil Garrou, Contributing Editor The IC industry “poker championship” is down to the last table The IC industry started out like a poker championship tournament. Hundreds of players, through the years, put up their entry fee to compete ( i.e. paying for their fabs) and the competition began. The most money was always made at the advanced nodes, i.e. the leading edge. There were winners [...]
- DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
IEDM 2017: Intel's 10nm Platform Process
By Dick James IEDM this year was its usual mixture of academic exotica and industrial pragmatica (to use a very broad-brush description), but the committee chose to keep us all waiting until the Wednesday morning before we got to the CMOS platform papers. Of course, the talk we were all anticipating was Intel’s Chris Auth on “A 10nm High Performance and Low-Power CMOS Technology Featuring 3rd [...]
- Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
IBM's Jeff Welser to Keynote The ConFab 2019
AI was a big focus on The ConFab and 2018 and we will continue that theme in 2019 with a keynote talk by IBM's Jeff Welser. The ConFab 2019 will return to The Cosmopolitan of Las Vegas on May 14-17. In 2018, AI and other leading technologies were discussed by speakers from IBM, Google, Nvidia, HERE Technologies, Silicon Catalyst, TechInsights, Siemens and Qorvo, among many others. AI, which represents [...]
MEMS & Sensors Industry Group (MSIG), a SEMI strategic association partner, is the "go-to" resource for globally linking the MEMS and sensors supply chain to diverse markets. For more information, visit: http://www.semi.org/en/msig-information-hub
Sensors in the New Age of the Car
By Richard Dixon, Senior Principal Analyst, Sensors, IHS Markit Sensors are inextricably linked to the future requirements of partially and fully autonomous vehicles. From highly granular dead-reckoning subsystems that rely on industrial-strength gyroscopes for superior navigation to more intelligent and personalized cockpits featuring intuitive human machine interfaces (HMIs) and smart seats, new [...]
- Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
What You Can Learn about Blue-X and EUV Sources in Prague During the 2018 Source Workshop
By Vivek Bakshi, EUV Litho, Inc. The 2018 Source Workshop is right around the corner in Prague (November 5-7, 2018, HiLASE, Prague, Czech Republic). This year, the new exciting topic is the start of discussions on options for extending EUVL via wavelength reduction – something that I have named Blue-X. Reduction of wavelength is one option for continued extension of optical projection lithography, [...]
- Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
Ruthenium Nanolayers are Ferromagnetic at RT
Researchers from Intel Corporation and the University of Minnesota and the University of Wisconsin have shown that strained atom-scale films of pure ruthenium (Ru) metal exhibit ferromagnetism at room temperature, openning up the possibility of using the material to build novel magnetic random access memory (MRAM) devices. As per details recently published in Nature Communications (https://doi.org/10.1038/s41467-018-04512-1), [...]