Electronics Manufacturing Blog


Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.



    Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
  • IFTLE 395: And Then There Were 3; IC History for the Younger Generation

    By Dr. Phil Garrou, Contributing Editor The IC industry “poker championship” is down to the last table The IC industry started out like a poker championship tournament. Hundreds of players, through the years, put up their entry fee to compete ( i.e. paying for their fabs) and the competition began. The most money was always made at the advanced nodes, i.e. the leading edge. There were winners [...]




    DICK JAMES is a 40-year veteran of the semiconductor industry and the senior technology analyst for Chipworks, an Ottawa, Canada-based specialty reverse engineering company. Chipworks analyses a broad range of devices, giving Dick a unique overview of what technologies make it into the real world of semiconductor production.
  • IEDM 2018 Coming Up!

    This is Part 1 of a multi-part blog series of previews of the upcoming IEDM 2018 conference. By Dick James On December 1st– 5ththe good and the great of the electron device world will make their usual pilgrimage to San Francisco for the 2018 IEEE International Electron Devices Meeting.  To quote the conference website front page, IEDM is “is the world’s preeminent forum for reporting [...]




    Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
  • The ConFab 2019 Speakers and Prelim Agenda

    The ConFab - an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies - announces a preliminary list of speakers for the May 14-17 event being held at The Cosmopolitan of Las Vegas. The ConFab 2019 is excited to welcome these distinguished speakers: Jeff Welser, Vice [...]




MEMS & Sensors Industry Group (MSIG), a SEMI strategic association partner, is the "go-to" resource for globally linking the MEMS and sensors supply chain to diverse markets. For more information, visit: http://www.semi.org/en/msig-information-hub

  • Getting to Low Power in IoT/IIoT Devices

    By Luca Fontanella and Simone Ferri Over the last three years the number of battery-operated electronic-component solutions for the Internet of Things (IoT) and Industrial IoT (IIoT) applications has been increasing steadily. This trend will continue for years to come, particularly with the growing popularity of mobile devices of all flavors. Addressing power consumption for battery-powered always-on [...]





    Dr. Vivek Bakshi blogs about EUV Lithography (EUVL) and related topics of interest. He has edited two books on EUVL and is an internationally recognized expert on EUV Source Technology and EUV Lithography. He consults, writes, teaches and organizes EUVL related workshops.
  • What You Can Learn about Blue-X and EUV Sources in Prague During the 2018 Source Workshop

    By Vivek Bakshi, EUV Litho, Inc. The 2018 Source Workshop is right around the corner in Prague (November 5-7, 2018, HiLASE, Prague, Czech Republic). This year, the new exciting topic is the start of discussions on options for extending EUVL via wavelength reduction – something that I have named Blue-X. Reduction of wavelength is one option for continued extension of optical projection lithography, [...]




    Ed's Threads - the first blog in the IC fab industry (launched 2006) - are Ed Korczynski's thoughts about IC, LED, and MEMS process development and about nanotechnology manufacturing markets. Ed has a degree in materials science and engineering from MIT, has decades of experience in Silicon Valley engineering and marketing, and won two ASBPE awards for editorial excellence writing for Solid State Technology. He is not lacking for opinions...
  • Ruthenium Nanolayers are Ferromagnetic at RT

    Researchers from Intel Corporation and the University of Minnesota and the University of Wisconsin have shown that strained atom-scale films of pure ruthenium (Ru) metal exhibit ferromagnetism at room temperature, openning up the possibility of using the material to build novel magnetic random access memory (MRAM) devices. As per details recently published in Nature Communications (https://doi.org/10.1038/s41467-018-04512-1), [...]