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Intel collaborates on new AI research center at Technion, Israel’s Technological Institute
10/09/2018Technion, Israel’s technological institute, announced this week that Intel is collaborating with the inst…
DRAM market braces for slower growth
10/03/2018History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans….
Automating 200mm semiconductor fabs to meet growing demand
10/10/2018SEMI met with Heinz Martin Esser, managing director at Fabmatics GmbH, to discuss how existing 200mm semiconductor fabs can master the challen…
Overcoming challenges of futuristic transistor technology below 5nm node
10/05/2018To scale down a transistor below a 5nm node is one of the vital concerns for VLSI industry as there are various challenges due t…
Tech Papers
Upcoming Webcasts
Advanced Packaging
Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and…
Lithography
Date and time TBDEUV lithography has been under intense development for years and appears to be close to…

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NEWS ANALYSIS & FEATURES


GLOBALFOUNDRIES expands RFwave Partner Program to speed time-to-market for wireless connectivity, radar and 5G

10/11/2018  GLOBALFOUNDRIES today announced the addition of nine new partners to its growing RFwave Partner Program.

The global compound semiconductor market grows on increasing demand for optoelectronic devices

10/11/2018  The global compound semiconductor market was valued at USD 66,623 million in 2016 and is expected to reach USD 142,586 million in 2023 while growing at a CAGR of 11.3% from 2017 to 2023.

Toshiba Memory Corporation appoints Stacy J. Smith as Executive Chairman

10/11/2018  Toshiba Memory Corporation (TMC) today announced the appointment of Stacy J. Smith as Executive Chairman, effective on October 1, 2018.

Research on light-matter interaction could improve electronic and optoelectronic devices

10/11/2018  Fundamental research sheds light on new many-particle quantum physics in atomically thin semiconductors.

Micron Foundation announces $1M grant to advance curiosity in artificial intelligence

10/11/2018  The grant was announced at the inaugural Micron Insight 2018 conference where the technology industry's top minds gathered in San Francisco to discuss the future of AI, machine learning and data science, and how memory technology is essential in bringing intelligence to life.

Cadence recognized with four 2018 TSMC Partner of the Year awards

10/10/2018  Cadence Design Systems, Inc. today announced that it has received four TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform (OIP) Ecosystem Forum.

GOWIN Semiconductor's GW1NS family of products named Arm TechCon 2018 Innovation Award finalist for design innovation of the year

10/10/2018  GOWIN Semiconductor today announced that its GW1NS product family was named a 2018 Arm TechCon Innovation Award finalist for design innovation of the year.

Study opens route to flexible electronics made from exotic materials

10/10/2018  Cost-effective method produces semiconducting films from materials that outperform silicon.

Presto Engineering upgrades Europe's largest independent semiconductor testing facility to ISO 9001:2015 standard

10/10/2018  Semiconductors play increasingly important control roles in automotive, industrial and safety critical applications. Quality and reliability are therefore of vital importance and so Presto Engineering has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is Europe’s largest independent semiconductor test facility.

Mentor releases optimized flow, new fill automation for GLOBALFOUNDRIES' 22FDX IC manufacturing process

10/09/2018  Mentor, a Siemens business, announced it has qualified complete solutions from its Calibre nmPlatform, Analog FastSPICE (AFS) Platform, Eldo Platform and Nitro-SoC place and route system for GLOBALFOUNDRIES' 22FDX Fully-Depleted Silicon-On-Insulator (FD-SOI) integrated circuit (IC) manufacturing processes.

Apple, the best positioned to bring high volume consumer microLEDs to market

10/09/2018  MicroLED displays could potentially match or exceed OLED performance in all critical attributes.

The Gigafab Minute and SEMI Standards: A modern miracle

10/09/2018  Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in today’s leading-edge semiconductor gigafabs.

INFICON acquires Final Phase Systems

10/05/2018  INFICON Inc., a supplier of vacuum instrumentation and process control software to the semiconductor manufacturing industry acquired all assets of Final Phase Systems (FPS) of Austin, Texas, USA.

Synopsys Design Platform enabled for TSMC's multi-die 3D-IC advanced packaging technologies

10/05/2018  Synopsys, Inc. today announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS) advanced packaging technologies.

Part-organic invention can be used in bendable mobile phones

10/05/2018  Engineers at The Australian National University (ANU) have invented a semiconductor with organic and inorganic materials that can convert electricity into light very efficiently, and it is thin and flexible enough to help make devices such as mobile phones bendable.

CMOS image sensors: Yole DĂ©veloppement is increasing its forecasts again

10/04/2018  2017 saw aggregated CIS industry revenue of US$13.9 billion. And 5 years later, the consulting company Yole announces more than US$ 23 billion.

AIM Photonics unveils support for datacom and telecom optical bands with its new silicon photonics PDK

10/04/2018  The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) today announced the release of the AP SUNY Process Design Kit v2.5a.

Boron nitride separation process could facilitate higher efficiency solar cells

10/04/2018  A team of semiconductor researchers based in France has used a boron nitride separation layer to grow indium gallium nitride (InGaN) solar cells that were then lifted off their original sapphire substrate and placed onto a glass substrate.

MSEC Tech Showcase to highlight MEMS & sensors innovations

10/04/2018  MEMS & Sensors Industry Group announces Technology Showcase finalists for MEMS & Sensors Executive Congress.

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Kinetics acquires Mega Fluid Systems

03/30/2018  According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line.



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VIDEOS

RECOMMENDED TECHNOLOGY PAPERS

Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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WEBCASTS

Advanced Packaging

  Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

  Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

  Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

EVENTS

Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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Leak check semiconductor process chambers quickly and reliably
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