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  SEMI testifies against third round of U.S. tariffs citing damage to semiconductor supply chain
08/27/2018In testimony last week before a U.S. government interagency panel considering tariffs on $200 billion wort…
 Worldwide semiconductor revenue hit record $120.8B in Q2 2018
08/22/2018Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018….
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 TSMC WannaCry infection forces shutdowns, financial losses
08/24/2018On August 3, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), the largest chip fabricator globally introduced a WannaCry Ransomware cryptow…
 New material could improve efficiency of computer processing and memory
08/22/2018Discovery could have major impact on semiconductor industry….
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Upcoming WebcastsAdvanced Packaging Date and time TBDBack-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and… LithographyDate and time TBDEUV lithography has been under intense development for years and appears to be close to… |
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RECOMMENDED TECHNOLOGY PAPERSMaximize uptime and optimize maintenance with AMSYukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018 Leveraging Baseline Checks for Robust Reliability VerificationAs IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018 Testing PAs under Digital Predistortion and Dynamic Power Supply ConditionsThe power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017 |
WEBCASTSAdvanced PackagingDate and time TBD Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.
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LithographyDate and time TBD EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.
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Environment, Safety & HealthDate and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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EVENTSMore Events |
NEW PRODUCTS KLA-Tencor announces new defect inspection systems
07/12/2018KLA-Tencor Corporation announced two new defect inspection products at SEMICON West this week, addressing two key challenges in tool and process monit...
 3D-Micromac unveils laser-based high-volume sample preparation solution for semiconductor failure analysis
07/09/2018microPREP 2.0 provides order of magnitude time and cost savings compared to traditional sample...
 Leak check semiconductor process chambers quickly and reliably
02/08/2018INFICON,a manufacturer of leak test equipment, introduced the UL3000 Fab leak detector for semiconductor manufacturing maintenance teams t...
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