Device Architecture

MAGAZINE



DEVICE ARCHITECTURE ARTICLES



Inexpensive chip-based device may transform spectrometry

10/23/2018  Tiny device could replace expensive lab-scale equipment for many applications.

U.S. announces trade talks with Japan, the EU, and UK; Action will benefit semiconductor industry

10/22/2018  Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, notified Congress that the administration intends to begin bilateral trade negotiations with Japan, the European Union (EU), and the United Kingdom.

MagnaChip to begin volume production of new automotive display driver IC

10/22/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced that volume production of a new Display Driver IC (DDIC) for automotive panel displays has begun.

Silvaco appoints Babak Taheri as Chief Technology Officer

10/22/2018  Dr. Taheri will be taking Silvaco’s advanced positions in FinFET and beyond nodes, novel materials, emerging memory and advanced display technologies, to the next level.

Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

Micron celebrates 40 years of leadership and innovation

10/18/2018  Micron global sites mark milestone with celebrations around the world.

Electrical enhancement: Engineers speed up electrons in semiconductors

10/17/2018  Researchers from Graduate School of Bio-Applications and Systems Engineering at Tokyo University of Agriculture and Technology (TUAT) have sped up the movement of electrons in organic semiconductor films by two to three orders of magnitude. The speedier electronics could lead to improved solar power and transistor use across the world, according to the scientists.

Mary Pat McCarthy and Steve Gomo appointed to Micron's Board of Directors

10/17/2018  Micron Technology, Inc. today announced it has appointed two distinguished  finance and technology industry leaders, Mary Pat McCarthy and Steve Gomo, to its board of directors and audit committee.

Communications rise to represent largest portion of foundry sales

10/17/2018  Communications apps expected to account for 3x more than computer in 2018 pure-play foundry sales.

SEMI reaffirms support for industry cooperation on RoHS review

10/16/2018  SEMI today confirmed its support for a Joint-Industry Cooperation on an RoHS Review aimed at urging the European Commission to, at a minimum, consider dedicating more resources to a targeted outreach programme with third countries.

Wafer shipments forecast to set new highs through 2021

10/16/2018  Total wafer shipments in 2018 year are expected to eclipse the all-time market high set in 2017 and continue to reach record levels through 2021.

MagnaChip introduces high-voltage super junction MOSFET

10/15/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the introduction of a new High-Voltage Super Junction MOSFET with a 900V breakdown voltage and low total gate charge.

Global semiconductor sales grow as the industry embraces IoT and blockchain technology

10/12/2018  Many semiconductor companies are beginning to embrace IoT to drive new revenue and growth models.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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VIDEOS