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DEVICE ARCHITECTURE ARTICLES



SIA releases statement on Trump Administration tariff announcement

06/20/2018  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, this week released the following statement regarding the Trump Administration's announcement on tariffs on products imported from China.

North American semiconductor equipment industry posts May 2018 billings

06/20/2018  North America-based manufacturers of semiconductor equipment posted $2.70 billion in billings worldwide in May 2018 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

imec presents complementary FET as scaling contender for nodes beyond N3

06/20/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3.

Imec furthers high-mobility nanowire FETs for nodes beyond 5nm

06/19/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

Imec demonstrates manufacturability of spin-orbit torque MRAM devices on 300mm Si wafers

06/18/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the world-leading research and innovation hub in nanoelectronics and digital technology, demonstrates for the first time the possibility to fabricate spin-orbit torque MRAM (SOT-MRAM) devices on 300mm wafers using CMOS compatible processes.

Qualcomm extends cash tender offer for all outstanding shares of NXP

06/15/2018  Qualcomm Incorporated has extended the offering period of its previously announced cash tender offer to purchase all of the outstanding common shares of NXP Semiconductors N.V.

Micross announces new executive appointment

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

Cautious optimism

06/15/2018  The World Bank just updated its multiyear forecast for GDP growth both globally and by country.

pSemi GaN FET driver delivers fast switching to solid-state LiDAR systems

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

WIN Semiconductors releases new platform integrating high performance 0.1um GaAs pHEMT with monolithic PIN and vertical Schottky diodes

06/13/2018  WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, has expanded its portfolio of highly integrated GaAs technologies with the release of a new pHEMT technology.

NXP introduces new high power RF products for 5G networks

06/12/2018  Company expands its Gallium Nitride (GaN) and LDMOS technology portfolios to offer a full range of high power products.

pSemi expands digital step attenuator portfolio with high-performance DSAs

06/12/2018  pSemi Corporation, a Murata company focused on semiconductor integration, announces the expansion of its digital step attenuator (DSA) portfolio with a family of value, high-performance DSAs.

Semiconductor equipment record spending streak to continue through 2019

06/12/2018  The semiconductor industry is nearing a third consecutive year of record equipment spending with projected growth of 14 percent (YOY) in 2018 and 9 percent in 2019, a mark that would extend the streak to a historic fourth consecutive growth year, according to the latest update of the World Fab Forecast report published by SEMI.

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Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

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