Device Architecture

MAGAZINE



DEVICE ARCHITECTURE ARTICLES



Adesto demonstrates resistive RAM technology targeting high-reliability applications

08/16/2018  Adesto Technologies, a provider of application-specific semiconductors for the IoT era, announced it will present new research showing the significant potential for Resistive RAM (RRAM) technology in high-reliability applications such as automotive.

WFE semiconductor equipment billings to drop 24% in second half of 2018

08/16/2018  On the heels of a 37.3% growth in wafer front end (WFE) semiconductor equipment growth in 2017, the market will grow only 10% in 2018 to $62.3 billion.

Automotive semiconductors to reach $73B by 2023, says Semico Research

08/15/2018  Automotive electronics are a bright light for the semiconductor industry, as smartphone growth slows, and personal computing growth continues to decline.

pSemi announces world's first monolithic, SOI Wi-Fi front-end module

08/15/2018  pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, introduces the world’s first monolithic, silicon-on-insulator (SOI) Wi-Fi front-end module.

NSF awards $1.2M to Rochester Institute of Technology, University of California-San Diego, University of Delaware

08/14/2018  Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

TowerJazz to hold Technical Global Symposium (TGS) in China

08/14/2018  TowerJazz, the global specialty foundry, announced details of its China Technical Global Symposium (TGS) event in Shanghai on August 22, 2018.

Size of semiconductor acquisitions may have hit limit

08/14/2018  Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism among more countries, and growing global trade frictions.

Strong 2Q'18 global supply chain growth but second half slowing

08/14/2018  Semiconductor capital equipment sales are historically very volatile, with their growth fluctuating MUCH MORE than electronic equipment.

Keysight Technologies acquires Thales Calibration Services

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

DRAM sales forecast to top $100B this year with 39% market growth

08/09/2018  With 24% IC marketshare, DRAM expected to account for nearly one in four IC sales dollars spent.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

SEMI China, CASPA promote China-Silicon Valley innovation partnership

08/08/2018  Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China.

MORE DEVICE-ARCHITECTURE ARTICLES

TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

Leveraging Baseline Checks for Robust Reliability Verification

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018
Sponsored by Mentor Graphics

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017
Sponsored by National Instruments

More Technology Papers

VIDEOS