Device Architecture

DEVICE ARCHITECTURE ARTICLES



RISC-V Foundation announces initial keynote speakers for inaugural RISC-V Summit

09/21/2018  First RISC-V Summit features keynotes from Antmicro, Facebook, Microchip Technology, NXP, SiFive and Western Digital.

Micron appoints Mike Bokan as Senior VP, Worldwide Sales

09/21/2018  Micron Technology, Inc. announced today that the company has appointed Mike Bokan as senior vice president of Worldwide Sales, effective Oct. 1, 2018.

SEMI FabView update: More investments in semiconductor fabs

09/21/2018  Global fab construction investment shows continuing strength, with 19 new fab projects expected to begin construction in 2019 and 2020, based on the latest data published in SEMI’s World Fab Forecast.

Toshiba Memory and Western Digital celebrate the opening of Fab 6 and Memory R&D Center at Yokkaichi, Japan

09/20/2018  Toshiba Memory Corporation and Western Digital Corporation yesterday celebrated the opening of a new semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan.

NXP Semiconductors announces $1B bridge financing

09/20/2018  NXP announced a US$1,000,000,000 senior unsecured bridge term credit facility agreement.

How will graphene, the 2D wonder material, change the semiconductor industry?

09/19/2018  What materials innovation will the future bring?

Seven IC products to outpace total 16% IC market growth in 2018

09/18/2018  13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.

Open-Silicon appoints new VP of Engineering

09/18/2018  Anand Bariya brings 25 years of engineering management experience to custom silicon solution provider.

TowerJazz annual U.S. Technical Symposium to showcase its advanced analog specialty process offerings

09/18/2018  During TGS, the company will share its vision on industry megatrends: "Wireless Everything, Smart Everything, Green Everything" - and the means by which its analog specialty portfolio helps customers to differentiate their technology solutions.

Keysight Technologies' 3D planar electromagnetic simulator certified for GLOBALFOUNDRIES 22FDX process technology

09/18/2018  Keysight Technologies, Inc. (NYSE: KEYS), a technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, today announced that the company's 3D planar electromagnetic (EM) simulator, Momentum, has been certified for GLOBALFOUNDRIES (GF) 22FDX, 22nm Fully-Depleted Silicon-On-Insulator (FD-SOI) technology.

GOWIN Semiconductor unveils the latest embedded memory products

09/17/2018  The 2 new embedded FPGA devices were designed with low power, small package size, and low cost in mind. 

New fabs invest over $220B; 2019 to mark all-time spending high

09/17/2018  Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending growth and the highest investment year for fab equipment in the history of the industry, according to the latest World Fab Forecast Report published today by SEMI.

Adesto completes acquisition of Echelon

09/14/2018  Adesto Technologies announced the successful completion of its previously announced acquisition of Echelon Corporation.

Industry growth: Still positive but varies by region

09/14/2018  Manufacturing activity continues to expand -- but at a slowing pace.

MCUs sales to reach record-high annual revenues through 2022

09/13/2018  MCU sales and units shipments driven by the spread of embedded control in systems, more sensors, and the rush to connect end-use applications to the Internet of Things (IoT).

SUNY Poly professor awarded $500,000 National Science Foundation grant to develop next-gen memory

09/13/2018  NSF grant supports SUNY Poly research for scalable computing infrastructure that mimics the synaptic functionality of the human brain.

"Dreams Start Here" at SEMICON Japan 2018 in era of AI

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

2019 ECTC abstract submission deadline is October 8

09/11/2018  This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

Worldwide semiconductor equipment billings reach $16.7B in second quarter 2018

09/10/2018  Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.

ASMC 2019 Call for Papers deadline is October 9, 2018

09/07/2018  Educate the industry about the latest in advanced processes and materials.




TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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