Device Architecture

DEVICE ARCHITECTURE ARTICLES



Lattice Semiconductor appoints Glenn O'Rourke as Corporate VP, Global Operations

12/11/2018  Lattice Semiconductor Corporation announced the appointment of Glenn O’Rourke as the Company’s Corporate Vice President, Global Operations, effective immediately.

SEMICON Japan 2018 opens tomorrow focusing on SMART applications

12/11/2018  SEMICON Japan 2018, the largest and most influential event for the electronics manufacturing supply chain in Japan with more than 70,000 attendees expected, opens tomorrow at Tokyo Big Sight.

Emerging NVM : PCM finally takes off in stand-alone applications

12/10/2018  Ever-growing data generation driven by mobile devices, the cloud, the IoT , and big data, as well as novel AI applications, all part of the megatrends, requires continuous advancements in memory technologies.

Synopsys and imec demonstrate accelerated modeling of complementary FET (CFET) technology

12/10/2018  Synopsys, Inc. announced today another milestone in its longstanding partnership with imec.

Global Semiconductor Alliance announces 2018 GSA Award recipients

12/07/2018  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2018 GSA Awards Dinner Celebration that took place last evening in Santa Clara, California.

Iron-rich lamellae in the semiconductor

12/07/2018  HZDR researchers produce unusual crystal structure.

Global semiconductor sales increase 12.7% year-to-year in October

12/06/2018  The global semiconductor industry posted solid year-to-year growth in October and is on pace for its highest-ever annual sales in 2018, but growth has moderated in recent months.

Crystal clear: Understanding magnetism changes caused by crystal lattice expansion

12/06/2018  An international team including researchers from Osaka University reports the control of the complex magnetic ground states in a simple cubic crystal through careful selection of ions of different size.

SEMI Industry Strategy Symposium leads microelectronics into new era

12/06/2018  SEMI ISS 2019 kicks off Technology Leadership Series of the Americas.

Artificial synapses made from nanowires

12/05/2018  Scientists from Jülich together with colleagues from Aachen and Turin have produced a memristive element made from nanowires that functions in much the same way as a biological nerve cell.

SEMI launches new semiconductor manufacturing workforce development campaign

12/05/2018  The semiconductor manufacturing industry is fighting to attract, educate, and retain the necessary talent for its continued growth.

CEA-Leti develops circuits for neuromorphic processors that replace CMOS transistor-based TCAM memory with RRAM-based TCAM memory

12/05/2018  Leti, a research institute at CEA Tech, has proven that RRAM-based ternary-content addressable memory (TCAM) circuits, featuring the most compact structure developed to date, can meet the performance and reliability requirements of multicore neuromorphic processors.

A new light on significantly faster computer memory devices

12/04/2018  A team of scientists from Arizona State University's School of Molecular Sciences and Germany have published in Science Advances online today an explanation of how a particular phase-change memory (PCM) material can work one thousand times faster than current flash computer memory, while being significantly more durable with respect to the number of daily read-writes.

SEMI welcomes efforts to reduce U.S.-China trade tensions

12/04/2018  The U.S. plans to delay tariff increases on $200 billion worth of Chinese imports, China has vowed to increase U.S. market access, and both parties are planning talks over the course of 90 days to address current frictions.

Global microelectronics experts develop SEMI's technology leadership series of the Americas

12/04/2018  World's largest lineup to advance industry roadmap in seven major conferences.

Silicon Labs joins Semiconductor Industry Association

12/03/2018  Silicon Labs President and CEO Tyson Tuttle elected to SIA board of directors.

New quantum materials could take computing devices beyond the semiconductor era

12/03/2018  Mutliferroics are promising candidates for new type of memory and logic circuits.

CEA-Leti and Silvaco to develop gate-all-around SPICE compact models for circuit design and tech co-optimization

12/03/2018  Leti and Silvaco Inc. today announced during the IEDM 2018 conference a project to create innovative and unified SPICE compact models for the design of advanced circuits using nanowire and nanosheet technologies.

Worldwide semiconductor equipment billings drop to $15.8B in third quarter 2018

12/03/2018  SEMI today reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11 percent higher than the same quarter a year ago.

Micron President and CEO Sanjay Mehrotra elected chair of Semiconductor Industry Association

11/30/2018  Keith Jackson, President, CEO, and Director of ON Semiconductor, elected SIA Vice Chair.




TWITTER


WEBCASTS



FD-SOI: An Optimal Technology for Integrated IoT and 5G Designs

Thursday, December 13, 2018 at 1 p.m. Eastern

As digital-centric scaling pursues solutions in 3D device architectures such as gate-all-around (GAA) transistors, most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance. This webinar is an overview of production-proven fully-depleted silicon-on-insulator (FD-SOI), the only post-bulk planar transistor technology. We will explain and demonstrate how FD-SOI delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.

Sponsored By:
Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

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TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



SPIE Advanced Lithography
San Jose, CA
http://SPIE.org/ral19sstvw
February 24, 2019 - February 28, 2019
LithoVision
San Jose, California
https://lithovision.com
February 24, 2019 - February 24, 2019
LED Expo Thailand
Bangkok, Thailand
http://www.ledexpothailand.com/
June 27, 2019 - June 29, 2019
SPIE Photomask Technology + EUV Lithography
Monterey, CA
http://SPIE.org/rpuv19sstvw
September 15, 2019 - September 19, 2019


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