Displays

MAGAZINE



DISPLAYS ARTICLES



MagnaChip to begin volume production of new automotive display driver IC

10/22/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced that volume production of a new Display Driver IC (DDIC) for automotive panel displays has begun.

Apple, the best positioned to bring high volume consumer microLEDs to market

10/09/2018  MicroLED displays could potentially match or exceed OLED performance in all critical attributes.

Plessey chooses AIX G5+ C MOCVD tool for GaN-on-Silicon monolithic microLEDs display innovation

09/20/2018  Plessey, a developer of award-winning optoelectronic technology solutions, announces it has placed an order for its next reactor from AIXTRON SE.

Commercially relevant bismuth-based thin film processing

09/19/2018  Researchers from Osaka University demonstrate a photoresponsive film processing technique that balances morphological properties with electronic performance.

Two quantum dots are better than one: Using one dot to sense changes in another

09/19/2018  Osaka University-based collaboration fabricates the first nanoelectronic device that can detect single-electron events in a target quantum dot using a second dot as a sensor.

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Tight supplies impede LCD panel cost reduction in third quarter of 2018

09/10/2018  Tight supplies of display panel materials and components, such as driver integrated circuit (IC), glass substrate and polarizer, are expected to slow the decline rate of liquid crystal display panel costs.

Large TFT LCD shipments hit record monthly high in July 2018

08/31/2018  Expanded production capacity, historical-low LCD TV panel prices and panel makers’ efforts to clear up inventories help.

Universal Display Corporation announces recipients of the 2018 UDC Innovative Research and Pioneering Technology Awards at IMID Korea

08/31/2018  These awards were presented at the 18th International Meeting of Information Display (IMID) conference on August 30, 2018 in Busan, Korea by Dr. Julie Brown, Senior Vice President and Chief Technology Officer of Universal Display.

Environmentally friendly photoluminescent nanoparticles for more vivid display colors

08/30/2018  Osaka University-led researchers created a new type of light-emitting nanoparticle that is made of ternary non-toxic semiconductors to help create displays and LED lighting with better colors that are more environmentally friendly.

Avegant closes $12M round of funding

08/28/2018  Avegant Corp. announced today that the company closed $12M in Series AA funding from new investors Walden SKT Venture Fund and China Walden Venture Investments III, L.P., as well as previous investors.

CTA study: China tariffs will cost the U.S. economy up to $2.4B annually

08/17/2018  The Trump administration's consideration of tariffs on Chinese printed circuit assemblies and connected devices would cost the economy $520.8 million and $2.4 billion annually for the 10 percent and 25 percent tariffs, respectively, according to a new study commissioned by the Consumer Technology Association (CTA).

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

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TWITTER


WEBCASTS



Advanced Packaging

Date and time TBD

Back-end packaging is increasingly important to semiconductor device form factor, thermal and power performance, and costs. Compounded by the demand for lead-free processing and the soaring cost of gold, the industry is developing new approaches to packaging, including redistribution layers (RDL), through silicon vias (TSV), copper pillars, wafer-level packaging (WLP) and copper wire bonding. Experts will discuss these and other approaches in this webcast.

Sponsored By:

Lithography

Date and time TBD

EUV lithography has been under intense development for years and appears to be close to production. Yet its delay has the industry searching for alternatives, including double, triple and even quadruple patterning, directed self-assembly, multi-e-beam and nanoimprint. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sponsored By:

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

More Webcasts

TECHNOLOGY PAPERS



Keysight's Parametric Measurement Handbook (Rev 4)

Keysight Technologies' popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.September 13, 2018
Sponsored by Keysight Technologies

Jumpstart Your Reliability Verification with Foundry-Supported Rule Decks

For many, formal reliability verification is a new process. Foundry-qualified and foundry-maintained reliability rule decks enable design and IP companies alike to establish baseline robustness and reliability criteria without committing extensive time and resources to the creation and support of proprietary verification solutions. In addition, as reliability verification needs expand, customer demand drives the development and qualification of new and augmented reliability rules.August 30, 2018
Sponsored by Mentor Graphics

Maximize uptime and optimize maintenance with AMS

Yukinobu Hayashi, Senior Field Applications Engineer from CyberOptics, explains the application uses of the WaferSense® Auto Multi Sensor™ (AMS) for Leveling, Vibration, and Relative Humidity (RH) that facilitates maximizing uptime and optimizes maintenance. The combination of these attributes in a thin wafer shaped all-in-one wireless sensor, provides engineers the ability to acquire highly repeatable measurements of tilt, vibration, and humidity while under a vacuum and without venting a chamber. The quantitative numeric results give engineers an objective basis for comparisons, and analysis that can be reproducible across multiple users over extended periods of time. June 13, 2018
Sponsored by CyberOptics

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EVENTS



Electronica
Munich, Germany
https://electronica.de/index.html
November 13, 2018 - November 16, 2018
EPTC 2018
Singapore
http://www.eptc-ieee.net/pages/home/2018
December 04, 2018 - December 07, 2018
Heterogeneous Integration Symposium
Milpitas, CA
http://www.meptec.org/2018Q4/
December 05, 2018 - December 05, 2018


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VIDEOS