TelesciCOM Selects IBM to Manufacture RF Chips

Tel Aviv, Israel-Oct. 25, 2000-Israel-based TelesciCOM Ltd. has selected IBM’s advanced silicon germanium (SiGe) process technology for its upcoming radio frequency (RF) chip. The RF chip, known as “Zero-IF,” is designed to integrate all the circuitry required to convert RF signals directly down to baseband frequencies and vice versa.

“IBM’s leading position in SiGe process development and the maturity level of its manufacturing were key to our choice,”says TelesciCOM CEO Avi Nudler.

IBM Microelectronics will manufacture the chip at its Burlington, Vermont fab using the 0.5-micron BiCMOS SiGe process technology IBM developed for high-performance, low-power communications and applications.

TelesciCOM is a provider of integrated circuits (ICs) and software solutions for fixed broadband wireless access and two-way broadband satellite access applications.


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