IMT offers getter deposition for wafer-level MEMS packaging

IMT says its vacuum levels equal or surpass those of other getter deposition services. (Image: IMT)

Apr. 10, 2007 — Innovative Micro Technology (IMT) has begun offering getter deposition services for wafer-level packaging of MEMS and other devices that require hard vacuum for device performance. Using its patent-pending getter, IMT says it has routinely achieved vacuum levels below 10 mTorr in production of inorganic devices for such applications as IR emission and sensing and for resonant oscillators in biological and chemical hazard detection applications.

IMT’s getter deposition services, offered in addition to shadow masking, are performed on 150mm or smaller wafers in IMT’s Class 100 cleanroom in Santa Barbara, California with 3-4 week turnaround for patterned wafers; faster turnaround is available.

IMT also offers a full suite of MEMS design, prototyping, and production manufacturing services to fabless and fab-light companies in its 30,000 square foot Class 100 fab, which the company says is “the largest and best-equipped independent MEMS fab in the world.”


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