Arradiance-ships-benchtop-atomic-layer-deposition-ALD-system to Oregon State U

(November 5, 2010 - BUSINESS WIRE) - Arradiance shipped their first of multiple orders of the GEMStar Atomic Layer Deposition (ALD) system to the School of Electrical Engineering and Computer Science at Oregon State University. With its capability to process up to 6" wafers using up to 8 precursors, GEMStar has the flexibility to deposit atomically thin layers of material on virtually any substrate and was designed with the most challenging high aspect ratio and through-pore deposition applications in mind.

"From our work with sensitive, high aspect ratio microchannel structures we became acutely aware of the need for a system that could repeatably and uniformly deposit complex nanolaminate films efficiently," explains David Beaulieu, COO of Arradiance."To meet the needs of the Research community, the tool needed to be small, but powerful and be flexible enough to handle the wide range of applications, substrates and materials commonly found in lab environments."

Dr. John F. Conley, OSU Professor states, "The GEMStar has everything our lab environment should need in an ALD tool. It is small, flexible and can handle up to 6" wafers. We also like the 1" height of the chamber that accommodates small, three dimensional objects and the port we can use for in-situ metrology. The design appears to be rugged and easy to service."

Our experience in materials science, charged particle physics and systems design have been combined to make a robust Research system for engineers, says Ken Stenton, Arradiance CEO. "Because of the importance of materials research in emerging growth industries such as biomedical, solar, space science, environmental and semiconductor, we saw the need for a research tool with production performance and reliability. We’re confident the GEMStar will meet this need."

Arradiance functional film technologies enhance the performance of imaging and detection systems, providing resolution, gain and lifetime improvements. Learn more at

Follow Small Times on by clicking Or join our Facebook group


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...