PTI buys NEXX deposition tool for RDL and Cu pillar fab

January 3, 2012 - PRNewswire — Packaging equipment provider NEXX Systems sold a 300mm Stratus electrochemical deposition (ECD) system to Powertech Technology (PTI), a major IC packaging and testing company in Taiwan. PTI will use the Stratus to make copper pillar bumps and re-distribution layers (RDL) for portable intelligent device packages, targeting smart phone and tablet PC applications.

The tool will be evaluated for PTI’s through silicon via (TSV) commercialization program.  

Also read: Nantong Fujitsu Microelectronics installs NEXX tool for copper pillar, RDL packaging

PTI is primarily known for memory device assembly, in high volumes, supplying integrated device manufacturers (IDMs) and fabless companies, said Scott Jewler, Senior General Manager, PTI. Jewler expects that the new deposition tool will help PTI lower the cost of leading-edge packaging.

NEXX Systems offers electrochemical deposition and physical vapor deposition systems for advanced semiconductor packaging. Learn more at

Subscribe to Solid State Technology/Advanced Packaging

Follow Advanced Packaging on by clicking Or join our Facebook group


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>


Radiant Vision Systems announces new automated visual inspection system
11/06/2017Radiant Vision Systems, a provider of high-resolution imaging solutions for automated visual analysis of devices and surfaces, an...
SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....