Present on semiconductor metrology and more at ASMC 2013

August 22, 2012 — ASMC, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers for next year’s event, being held May 14-16 in Saratoga Springs, NY. The abstract deadline is October 24, 2012. ASMC 2013 is now accepting abstracts in 16 topic areas:

  • Packaging and through-silicon via (3D/TSV)
  • Advanced equipment processes and materials (AEPM)
  • Advanced metrology (AM)
  • Advanced patterning / Design for manufacturability (AP/DFM)
  • Advanced process control (APC)
  • Contamination free manufacturing (CFM)
  • Defect inspection and reduction (DI)
  • Data management and data mining tools (DM)
  • Equipment reliability and productivity enhancements (ER)
  • Enabling technologies and innovative devices (ET/ ID)
  • Factory automation (FA)
  • Green factory (GF)
  • Industrial engineering (IE)
  • Lean manufacturing (LM)
  • Yield enhancement/learning (YE)
  • Yield methodologies (YM)

All papers will be considered for the Entegris Best Paper Award, and student-authored papers are eligible for consideration as the GlobalFoundries Outstanding Student Paper. Select papers also will be featured in the IEEE Transactions on Semiconductor Manufacturing.

Learn more about being a speaker at ASMC here: http://www.semi.org/en/node/38316.

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