Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation

January 19, 2012 - BUSINESS WIRE -- Optomec Inc., additive manufacturing systems provider, opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet technology for advanced printed electronics applications.

The new facility comprises 7600 square feet of office and general laboratory space and will be utilized for both advanced development of Aerosol Jet Printed Electronics Applications and for new product engineering. Dr. Mike Renn will continue his role as Director of Aerosol Jet Advanced Application Development, and John Lees, recently appointed Director of Aerosol Jet New Product Development, will lead the product engineering team at the new facility. In conjunction with the expansion, Optomec is looking to double its local staff.

Optomec's Aerosol Jet systems for Printed Electronics utilize a proprietary material deposition process to direct write high resolution electronic circuitry, components and even complete devices on 2D and 3D surfaces. The Aerosol Jet deposition process is highly efficient and supports a wide variety of electronic materials compared to traditional subtractive manufacturing processes. Aerosol Jet systems can be used to both lower costs and enhance performance of current electronic devices, as well as to enable the creation of next generation products, such as 3D semiconductor packaging, high efficiency solar cells and solid oxide fuel cells.

Also read: Optomec aerosol jet printing featured as wire bond, TSV alternative

Optomec provides of additive manufacturing solutions for high-performance electronics, solar, medical, and aerospace & defense applications using its Aerosol Jet printed electronics technology and LENS powder-metal fabrication technology. To learn more, visit http://www.Optomec.com



07/03/2012
Volume 55, Issue 6

Article Archive for Advanced Packaging.

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