STATS ChipPAC ships 1 billionth package using copper wire bonds


June 18, 2012 - Marketwire -- Semiconductor packaging and test services provider STATS ChipPAC Ltd. (SGX-ST: STATSChP) marked the milestone of 1 billion copper wirebonded semiconductor units shipped. STATS ChipPAC offers high-volume semiconductor assembly and dedicated engineering expertise to developing a copper wire bonding process to suit advanced, multi-die laminate and leaded packages including 3D packaging.

STATS ChipPAC’s copper wire packaging roadmap serves a diverse customer base, and more and more customers are switching to copper wire interconnects from gold, said Wan Choong Hoe, EVP and COO, STATS ChipPAC.

STATS ChipPAC's copper wire offering is rapidly expanding with wire diameters down to 0.6mils and a broad technology offering including die-to-die bonding and a range of 3D package configurations including stacked die, side-by-side die and a combination of stacked plus side-by-side die packages. The packaging company is “actively qualifying and ramping to production a wide range of advanced multi-die laminate and leaded packages as well as thermally enhanced mold compounds compatible with copper wire to further increase thermal performance,” Hoe added. STATS ChipPAC produces 40nm copper wire bonded packages in volume, with 28nm qualified.

Copper wire provides better conductivity than gold, improved electrical and thermal performance, and stronger mechanical properties. Cost reduction is a primary driver for the industry's conversion to copper wire. STATS ChipPAC has also focused on material and process enhancements such as palladium (Pd) coated wire and ultra high density substrates to drive cost reduction and enable customers to realize the full benefits of copper wire interconnect. STATS ChipPAC is qualifying copper wirebond interconnect on ultra high density strips for both leaded and laminate packages.

STATS ChipPAC Ltd. provides semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. STATS ChipPAC is listed on the SGX-ST. Further information is available at

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