STATS ChipPAC ramps advanced flip chips to HVM, adds TCB processing capability


July 9, 2012 -- STATS ChipPAC Ltd. (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, brought its fcCuBE advanced flip chip semiconductor packaging technology with copper column bumps, bond-on-lead (BOL) interconnection, and enhanced assembly processes into high-volume manufacturing (HVM) for multiple customers. STATS ChipPAC expanded its assembly processing capabilities to address a wider spectrum of bump pitch ranges from >200µm to <80µm. 

fcCuBE technology aims for lower-cost and more scalable flip chip packaging at much finer bump pitches and higher input/output (I/O) densities. STATS ChipPAC combines its proprietary BOL interconnect structure with Cu column bumps. The architecture eliminates stress on the delicate extremely low-k/ultra low-k (ELK/ULK) structures at advanced silicon wafer nodes. fcCuBE supports standard mass-reflow assembly or thermo-compression bonding (TCB). Mass reflow enables a 10-30% cost reduction in package designs compared to conventional flip chip interconnect, and can be used down to 80µm bump pitch. STATS ChipPAC is in development of finer pitches.

TCB assembly supports ultra-high densities at advanced silicon nodes and emerging 3D technology such as through silicon via (TSV) interconnection. It is more complex than mass reflow, with increased precision for bonding higher-density and tighter-pitch flip chip designs. For fine-pitch bump requirements, TCB enables the assembly of very small bump diameters in more advanced wafer fab nodes and supports bonding requirements such as chip-to-substrate or chip-to-chip.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications. STATS ChipPAC is listed on the SGX-ST. Further information is available at

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