Nanium ships 200 millionth eWLB component

October 10, 2012 - Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a milestone reached in less than two years. The achievement represents a 10% year-over-year productivity increase, and reflects full conversion to the company's eWLB overmold technology that allows both thinner and more robust packages, according to the company.

The shipment milestone "demonstrates that eWLB technology is a robust low-cost solution delivering both high reliability and high yields for manufacturing advanced electronic products with high I/O density in a small form-factor," stated Armando Tavares, president of NANIUM’s executive board.

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eWLB offers numerous advantages for complex and highly integrated solutions required by applications in mobile and portable electronics. Nanium's 300mm eWLB technology uses a combination of traditional front-end and back-end semiconductor manufacturing techniques with parallel processing of all the chips on the wafer. The result is increased integration of the silicon's overall protective package and a dramatically higher number of I/Os per area, which translates to significant cost and size benefits for manufacturers of cutting-edge wireless and consumer products.

Nanium, originally the largest semiconductor packaging assembly and test operation within Qimonda, was one of the first chip companies to build up volume capacity for 300mm eWLB wafers, completing the ramp-up in late 2010. More recently it has adapted the technology for consumer MEMS, stacked die DRAM multichip packages (MCP) for high-capacity memory applications, and other uses.

Volume 55, Issue 8

Article Archive for Advanced Packaging.


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