Semiconductor wafer fab equipment trends: Deposition

April 10, 2012 — Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step. Here, CJ Muse separates the rising and declining styles of deposition.

In 2011, deposition intensity (% of total WFE spending) stayed fairly flat at 20.6%.

Chemical vapor deposition (CVD) tools saw a decline in chip fab spending, dropping from 62% in 2010 to 58% in 2011. Meanwhile, electrochemical deposition (ECD) and physical vapor deposition (PVD) stayed roughly flat as a percentage of the overall deposition market. Gains were seen in the “other” portion, namely atomic layer deposition (ALD). ALD is used for the high-k gate dielectric in high-k/metal gate (HKMG) devices. Other as a whole picked up 4% share.

For more about the top players in deposition and other WFE segments, read Wafer fab equipment leaders in 2011 and expectations for 2012

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