Enhancing the Reliability of Flip Chip Assemblies with Underfill Encapsulants

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.





Master Bond, Inc.,


Format: PDF
Size: 834.83K



To view this White Paper, please log in or register




Register



* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone


Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

LIVE NEWS FEED

NEW PRODUCTS

Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...
New fiber optic temperature sensing and control system ideal for RF environments
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature me...