ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cleaving and drilling of glass up to 10mm thickness. Using less than 100 watts of laser power, most transparent, hard and brittle materials, like sapphire, quartz or heat- and chemically-strengthened glass, can be cut at speeds of up to 1 meter per second. The resulting kerf width is about 1 micron and the edges are smooth with a measurable surface roughness of less than 1 micron. Cutting interior features like holes, slots and other shapes down to 2 mm is possible without damage to the surrounding material. The process is silent, non-contact, produces minimal debris and has low consumable costs. Stack glass sheets can also be cut without damage to individual layers.
The ROFIN SmartCleave FI laser process eliminates conventional, mechanical methods with their inherent and significant drawbacks (low scribing quality, micro-cracks, chipping, accuracy limitations, additional time-consuming and labor-intensive processing steps, etc.) and results in fast processing and higher yields.
This unique, IP-protected laser cutting process opens the door to huge application areas, and is of particular interest to manufacturers of consumer electronics, medical devices, integrated circuits, architectural, automotive, aerospace, and a variety of other market segments.
ROFIN will debut this new technology at SEMICON WEST 2015.