NXP and GlobalFoundries announce production of 40nm embedded non-volatile memory technology

GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GLOBALFOUNDRIES’ 40-nanometer (nm) process technology platform. GLOBALFOUNDRIES is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology.  Volume production is expected in 2016 at its Singapore facility.

The successful execution of joint development and technology production milestones will enable faster time to market of high density on-chip eNVM for innovative applications in a variety of products including identification, near-field-communication, healthcare, and microcontrollers. NXP will leverage GLOBALFOUNDRIES’ leading-edge semiconductor manufacturing capability to apply the overall technology to 40nm eNVM that will bring competitive value to end customers.

“We are pleased to see the co-developed 40nm-LP eNVM technology is ready for production in GLOBALFOUNDRIES facility,” said Dr. Hai Wang, executive vice president of Technology and Operations at NXP Semiconductor. “GLOBALFOUNDRIES is the first foundry that developed this process technology specifically targeting markets that require embedded non-volatile memory products. The successful release to production will enable NXP to further strengthen our market leadership in offering advanced solutions for secure and near field communication market segments.”

“We have a long-standing and close collaboration with NXP across other technology nodes. The successful joint development of eNVM gives us a boost in our confidence in the marketplace as we advance our 40nm technology leadership,” said KC Ang, SVP and GM for GLOBALFOUNDRIES Singapore. “We look forward to having additional eNVM technology offerings for future market opportunities.”

GLOBALFOUNDRIES’ manufacturing site in Singapore is certified by the German Federal Office for Information Security (BSI) for secure IC products manufacturing.  In 2012, the foundry received Common Criteria ISO 15408-EAL 6 certification and successfully received renewal in 2014. The company is also a two-time winner of NXP annual supplier award for best foundry services.


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