Entegris elects James P. Lederer to Board of Directors

Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company’s Annual Meeting of Shareholders held today. Mr. Lederer’s career spanned more than 32 years, with the last 18 in the semiconductor industry, including six years as an executive officer at Qualcomm.

“I am delighted to have Jim on our board,” said Bertrand Loy, president and CEO of Entegris. “Jim’s experience at Qualcomm brings an important customer and industry perspective. I look forward to his contributions and his insight as a member of our board.”

Paul Olson, chairman of the board of Entegris, added: “Through his career Jim has demonstrated a keen understanding of what it takes to succeed in a fast-paced technology industry, having played a key role in driving Qualcomm to be a technology powerhouse. I think his perspective on the industry will be an invaluable addition to the board.”

“Entegris is increasingly viewed as an indispensable partner by the semiconductor industry’s technology leaders.” says Lederer. ”I look forward to working with Bertrand and his leadership team to continue to drive growth and success at Entegris.”

Mr. Lederer most recently served as Executive Vice President of Qualcomm Technologies, Inc. and General Manager of Qualcomm CDMA Technologies (QCT, semiconductor division). He retired from Qualcomm in January 2014. During his 18-year career at Qualcomm, Mr. Lederer also served in a number of senior management and finance roles. Prior to joining Qualcomm, Mr. Lederer held a variety of management positions at Motorola, General Motors and Scott Aviation. Mr. Lederer holds a B.S. degree in Business Administration (Finance/MIS) and an M.B.A. from the State University of New York at Buffalo, where he also serves on the Dean’s Advisory Council for the School of Management.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...