Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

Altatech, a specialty equipment manufacturer for mature and advanced materials deposition and defect inspection, announced today the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies. The Eclipse TS represents a unique high-reliability and easy-to-implement inspection system solution ready for mass production, in response to the demand for these advanced substrates being driven by the rapidly growing markets in automotive, industrial power and mobile electronics. The Eclipse TS has been qualified for volume manufacturing at a leading-edge semiconductor manufacturer.

“We have built a tool based on a strong IP portfolio with a unique capability to inspect the front side, back side and edge of very thin wafers. This is a cost-effective solution with very good throughput. It places Altatech in a leading position within a very large market opportunity,” said Jean-Luc Delcarri, general manager of Soitec’s Altatech Division.

The Eclipse TS is a high-speed inspection system for measuring very thin and stacked wafers down to 50 microns, Taiko rings, stacked substrates, and silicon-on-glass wafers. The system can conduct front-side, back-side and edge inspection in one pass with no back-side contact and accommodate very high bow and wrap wafers up to 6 mm. In today’s 3D technologies, substrates undergo grinding, stacking and gluing. The Eclipse system is able to monitor these processes. Inspection occurs without any contact on the active surface with a throughout of more than 90 wafers per hour for 300-mm substrates.

Compliant with the latest automation standards, the Eclipse TS offers comprehensive reporting for defects classification and yield maps.

The full Altatech Eclipse series of advanced metrology and holistic inspection systems ensure wafer-surface and edge quality by detecting, counting, and binning defects during the wafer manufacturing process as well as performing continuous outgoing wafer-quality inspection. Proprietary Eclipse sub-modules are designed to detect particles and defects of interest on the front surface and wafer edge of patterned or unpatterned wafers.

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