Ultratech, Inc., a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of Dresden, Germany, a specialist in process optimization and overlay control solutions for leading-edge semiconductor lithography, announced that the companies are jointly developing a 3D lithography advanced process control (APC) solution for advanced 3D CMOS manufacturing. Building on the companies’ respective leadership in 3D inspection and lithography APC, the solution will allow Ultratech’s Superfast to interface with Qoniac’s OVALiS, the leading lithography process optimization solution. As a result, the goal of this interface is to enable a new level of lithography 3D correctable performance that leverages Superfast’s high-density distortion sampling and OVALiS’ dynamic field-by-field feedback and feed-forward control.
Arthur W. Zafiropoulo, Ultratech’s CEO, said, “I am delighted to partner with Qoniac to provide our mutual customers a new level of 3D correctable performance. Today’s leading-edge fabs require better overlay control as one of the critical parameters affecting good process yields. Superfast has now been adopted for high-volume, 3D distortion control and lithography feed-forward applications. Qoniac’s expertise and leadership in lithography APC will help drive innovation so that we can provide our customers with new capabilities they need as they move to the next generation of Vertical NAND, DRAM and FinFET processes.”
Adwin Timmer, CEO at Qoniac, said, “Our current joint development with Ultratech for 3D lithography APC will enhance our lithography APC capabilities with distortion correction. As the industry increases the use of 3D manufacturing to lower cost, structural distortion has become a major component of the overlay budget. Ultratech’s Superfast CGS technology has given the 3D manufacturing leaders control over these distortions. Qoniac’s OVALiS aims to insure that this control is smart, dynamic and with the highest yields.”
Ultratech’s Superfast 4G+ Inspection System
Based on patented coherent gradient sensing (CGS) technology, Ultratech’s Superfast 4G+ inspection system for patterned wafers provides the industry’s highest throughput, with a low cost-of-ownership compared to competing systems. Building on the field-proven Superfast platform, Ultratech’s 4G+ Inspection System provides the industry with a 3D topography inspection solution for advanced lithography applications with the flexibility to measure front-side of patterned wafers anywhere in the production line. Its direct, front-side 3D topography measurement capability is well suited for patterned wafer applications such as displacement feed-forward to the scanner, 3D topography measurement for focus control, and high-stress process control.
Qoniac’s OVALiS Litho Process Optimization and Control Solution
Based on patent-pending algorithms, Qoniac’s OVALiS software suite provides the industry’s most advanced solutions for process optimization, diagnostics, monitoring and control, resulting in the best possible on-product litho performance and corresponding yields. Its diagnostic and simulation capabilities ensure shortest time-to-market and unrivalled optimization of the litho manufacturing process. Its monitoring and dynamic litho APC capabilities enable advanced excursion detection, reliable overlay dispositioning and optimal field-by-field APC corrections with the tightest possible specs.