ACM demonstrates damage-free cleaning technology on 1Xnm patterned wafer

ACM Research (Shanghai), Inc. has announced that it has solved the problem of patterned wafer cleaning. This is another breakthrough at ACM after it developed Space Alternating Phase Shift (SAPS) megasonic cleaning in 2011.

Compared to flat wafer cleaning, patterned wafer cleaning is much more complicated and challenging. With the decreasing line width and increasing aspect ratio, cleaning a patterned wafer without damage is much more difficult than ever. Meanwhile, as the feature size continues to shrink, the impact of fine particles (less than 30 nm) and contaminates to final device yields are much more significant.

“Finding the solution for patterned wafer cleaning has been an urgent challenge for the semiconductor equipment industry in recent years,” Dr. David Wang, President and CEO of ACM, mentioned. “When it comes to 1X nm and below manufacturing nodes, you must be capable of cleaning particle sizes smaller than tens of nm, and one cleaning step is used on average after every two non-clean processing steps in order to achieve high yield. This is where ACM’s proprietary megasonic cleaning technologies areuniquely effective.”

ACM’s newly-developed, proprietary Timely Energized Bubble Oscillation (TEBO) technology solved the problem of pattern damages caused by transit cavitation in the conventional megsonic clean process. By using TEBO, the cavitation becomes stable without bubble implosion or collapse during megasonic cleaning processing. The damage-free physical cleaning capability of TEBO with high Particle Removal Efficiency (PRE) has been demonstrated on 1X nm patterned wafers. The TEBO cleaning technology can be applied not only in FinFet manufacturing processes, but also in the high aspect ratio of DRAM and 3D NAND manufacture processes. (Aspect ratio of 30:1 or even 60:1.)


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>


Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....