Panel Discussion: Heterogeneous Integration
Organized and Sponsored by IEEE CPMT
Co-Moderators: Dr. William Chen, Fellow, ASE and Dr. Li Li, Distinguished Engineer, Cisco
System level package innovation and heterogeneous integration encompass a wide range of technologies, including module and 3D packaging, system-in-package (SiP), fanout, and embedded technologies. But questions remain - How will these technologies be utilized in advanced data centers and network systems, in future smart phones, and the growing medical, industrial and lifestyle IoT applications? This session will look at just how packaging technologies are enabling innovative solutions that achieve system application requirements while maximizing system level performance, and, meeting cost, performance, form factor and reliability goals.