EDITORS' PICKS

	SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry 07/09/2013 When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday...
	Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017 07/02/2013 Capacity for 200mm wafers forecast to slip more than 10 points during same period.

	Leti and EV Group launch a common lab on wafer bonding technologies 07/10/2013 Project targets more efficient 3D TSV integration and covalent bonding at room temperat...
	Boston University sues Apple over semiconductor patent infringement 07/03/2013 Boston University filed a lawsuit against Apple Inc. and several other big tech compani...

MAGAZINE

BLOGS

NEWS ANALYSIS & FEATURES

New methods to reduce time and cost of R&D;

07/09/2013 SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to Hi...

SEMI announces board elections and leadership appointments

07/09/2013

SEMI today announced the results of its annual Board of Directors elections.

SEMI sees 21% increase in chip equipment spending for 2014

07/09/2013

SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending.

Leti’s IDEAL and IMAGINE programs extend 193i immersion lithography for 1x nodes

07/09/2013 CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels ...

Element Six increases global manufacturing capacity for microwave CVD synthetic diamond

07/09/2013 At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compare...

Dow Corning joins imec for advancement of enabling technologies for 3D-IC

07/09/2013

Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

EV Group announces strong growth and new manufacturing processes at SEMICON West 2013

07/09/2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and...

Alchimer signs collaboration with CEA-Leti

07/09/2013 Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.

Imec reveals method of damage free cryogenic etching of ultralow-k dielectrics

07/09/2013

New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.

EVG pushes the limits on 3D-IC manufacturing

07/08/2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG40NT autom...

Toshiba to expand semiconductor fabrication facility

07/03/2013 Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

F450C hosts panel during SEMICON West to address 450mm facility infrastructure

07/03/2013 Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world ...

CEA-Leti receives 1M euro in funding from bpifrance

07/03/2013

CEA-Leti announced today €1 million in funding from bpifrance to accelerate preclinical development of a liver-cancer detection system called LipImage 815.

BOE Technology Group and Applied Materials to deliver leading-edge display technologies

07/03/2013 BOE Technology Group announced that it has placed significant orders for advanced Gen 8.5 and Gen 5.5 display production equipment from Applied Materials for use in multiple facilities.

MORE ANALYSIS & FEATURES

VIDEOS

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Flip Chip Devices get Flat and Happy

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EVENTS

2nd World Congress on Integrated Computational Materials Engineering

Salt Lake City, UT

http://www.tms.org/meetings/2013/ICME2013/home.aspx

July 7, 2013 - July 11, 2013

SEMICON West

San Francisco, California

www.semiconwest.org

July 9, 2013 - July 11, 2013

The 8th Pacific Rim International Conference on Advanced Materials and Processing

Waikoloa, HI

http://www.tms.org/meetings/specialty/pricm8/home.aspx

August 4, 2013 - August 9, 2013

More Events

FINANCIALS

NEW COMMENTS

NEW PRODUCTS

	ROFIN presents turnkey solutions for FEOL applications July 2, 2013 The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading ...
	EV Group launches new LowTemp room temperature debonding platform July 1, 2013 EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today i...
	All-in-one microscope for advanced imaging, recording and measurement June 7, 2013 Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.