SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

07/09/2013 When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday...

Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017


Capacity for 200mm wafers forecast to slip more than 10 points during same period.

Leti and EV Group launch a common lab on wafer bonding technologies

07/10/2013 Project targets more efficient 3D TSV integration and covalent bonding at room temperat...

Boston University sues Apple over semiconductor patent infringement

07/03/2013 Boston University filed a lawsuit against Apple Inc. and several other big tech compani...


New methods to reduce time and cost of R&D;

07/09/2013 SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to Hi...

SEMI announces board elections and leadership appointments


SEMI today announced the results of its annual Board of Directors elections.

SEMI sees 21% increase in chip equipment spending for 2014


SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending.

Leti’s IDEAL and IMAGINE programs extend 193i immersion lithography for 1x nodes

07/09/2013 CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels ...

Element Six increases global manufacturing capacity for microwave CVD synthetic diamond

07/09/2013 At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compare...

Dow Corning joins imec for advancement of enabling technologies for 3D-IC


Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

EV Group announces strong growth and new manufacturing processes at SEMICON West 2013

07/09/2013 EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has achieved strong revenue growth and...

Alchimer signs collaboration with CEA-Leti

07/09/2013 Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.

Imec reveals method of damage free cryogenic etching of ultralow-k dielectrics


New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.

EVG pushes the limits on 3D-IC manufacturing

07/08/2013 EV Group (EVG), a  supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG40NT autom...

Toshiba to expand semiconductor fabrication facility

07/03/2013 Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

F450C hosts panel during SEMICON West to address 450mm facility infrastructure

07/03/2013 Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world ...

CEA-Leti receives 1M euro in funding from bpifrance


CEA-Leti announced today €1 million in funding from bpifrance to accelerate preclinical development of a liver-cancer detection system called LipImage 815.

BOE Technology Group and Applied Materials to deliver leading-edge display technologies

07/03/2013 BOE Technology Group announced that it has placed significant orders for advanced Gen 8.5 and Gen 5.5 display production equipment from Applied Materials for use in multiple facilities.


Electroiq 2 EIQ2


Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are interested in statistical analysis of volumes of high-quality diagnosis results...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage –i.e. maintain a relative degree ...
Sponsored by

Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and control embedded IP, the new IEEE P1687 standard 1 is being defined by a broad coalition of ...


Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps.  An additional challenge is t...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business development director, Lode Lauwers, on why 450mm ...
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ROFIN presents turnkey solutions for FEOL applications

July 2, 2013 The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading ...

EV Group launches new LowTemp room temperature debonding platform

July 1, 2013 EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today i...

All-in-one microscope for advanced imaging, recording and measurement

June 7, 2013

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.


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