LED BLOGS
Solid State Technology’s bloggers provide an insider’s point-of-view for electronic manufacturing such as semiconductor wafer fab, micro electromechanical systems (MEMS) manufacturing, and advanced packaging and test product announcements, industry tradeshows, process advances, and technologies.
INSIGHTS FROM THE LEADING EDGE
Dr. Phil Garrou gives his insight into leading edge developments in 3-D integration and advanced packaging, reporting the latest technical goings on from conferences, conversations, and more.
IFTLE 153 IMAPS DPC part 3 Leti, Dow, STATSChipPAC
Wed Jul 03 16:25:00 CDT 2013
Finishing up our look at the 2013 IMAPS Device Packaging ConferenceLetiLeti examined the reliability of die to wafer bonding using copper/tin interconnects. Above 232 C tin rapidly reacts with copper to produce higher melting point intermetallic compounds. They studied thermal cycli...
Read More >>
IFTLE 152 2013 IMAPS Device Packaging Conference part 2
Sat Jun 22 16:04:00 CDT 2013
Continuing with our coverage of the March IMAPS DPC. TI In his keynote presentation on semiconductor packaging trends Devan Iyer of TI showed a great chart on package shrinkage through the years. We have moved from the 1.75mm SOIC to the picostar 2G at 0.075mm which they claim to be the t...
Read More >>
IFTLE 151 2013 IMAPS Device Packaging Conf part 1 - Amkor
Sun Jun 16 11:30:00 CDT 2013
I’ll be interspersing reports from DPC with ECTC and ICEP reports so pay attention as to where the material over the summer is coming from. In addition I will be covering ConFab and Semicon West so there will be a lot of information coming your way. The IMAPS DPC , Proceedings and the Lite...
Read More >>
IFTLE 150 ICEP Osaka part 1
Mon Jun 10 10:22:00 CDT 2013
The Int Symp on Electronic Packaging was held in Osaka the week of April 10th with keynote speakers, Dr. Subramanian S. Iyer of IBM, Dr. Takeshi Uenoyama of Panasonic, and Dr. Urmi Ray of Qualcomm. General Chair was Shintao Yamamichi of Renesas and Technical program Chair was Hitoshi Saka...
Read More >>
IFTLE 149 2013 ECTC part 1
Tue Jun 04 09:45:00 CDT 2013
The undisputed Jewel of IC packaging conferences, the ECTC (Electronic Component Technology Conference) took place this past week in Las Vegas with 1300+ attendees, 95 exhibitors and IFTLE in attendance. Over 600 submitted abstracts resulted in ~300 presentations (verbal and poster) and the...
Read More >>
IFTLE 148 The Future of Packaging: A Look From 50,000 Feet
Sat May 25 11:36:00 CDT 2013
There is a saying in American business that recommends if you really want to understand something you need to take a “50,000 foot look” (for those of you on the metric system, that’s 15.2 km). The logic behind this goes something like: if you're engaged in a battle and need to k...
Read More >>
PETE'S POSTS
Pete's Posts covers topics germane to the electronics and solar industries, including semiconductor and photovoltaic solar cell manufacturing, advanced packaging, nanotechnology, MEMS and circuit board assembly.
Tackling Design for Yield Questions at DAC
Wed May 22 15:39:00 CDT 2013
Process variations are unavoidable, but how can chip designers plan for them in their designs to obtain optimal yield and device performance? That’s one of the focal points of a pavilion panel at the upcoming Design Automation Conference (DAC), to be held June 2-6 in Austin, TX. Titled "Le...
Read More >>
Join The ConFab discussion
Tue Feb 26 11:27:00 CST 2013
The ConFab is Solid State Technology's annual conference and networking event. This year, it will be held June 23-26 at The Encore at The Wynn in Las Vegas. We recently started a LinkedIn group, where we will inform members of new activities, and keep the discussion going on topics related to sem...
Read More >>
Questions and answers on FD-SOI
Fri Jan 04 14:56:00 CST 2013
A month or so ago, we implemented (without much fanfare) the ability to comment and rank articles on this site, and more easily use social media tools. I’d like to call your attention to one interesting exchange, and also invite you to start posting comments of your own. In mid-December, we...
Read More >>
Present your ideas at The ConFab in 2013
Mon Nov 26 09:04:00 CST 2012
The ConFab is now accepting abstract submissions for our 2013 conference, to be held June 23-26 in Las Vegas. If you’re an executive at a leading semiconductor manufacturer and would like to present at The ConFab and participate in three days of productive meetings and roundtable discussion...
Read More >>
The ConFab 2013 countdown begins
Thu Aug 09 16:18:00 CDT 2012
The countdown to The ConFab has officially begun. The dates are set: next year’s event will be held June 23-26, 2013 and we’ll be back at the Encore at The Wynn Las Vegas (an encore at The Encore!). Thanks to everyone who participated last year. We had two great keynotes – John ...
Read More >>
The ConFab: Big data is here
Sun Jun 03 19:19:00 CDT 2012
Sponsors and delegates arrived today in sunny Las Vegas, for the 8th annual "The ConFab," our conference and networking event that features planned meetings between conference sessions. Everything is set up and we're ready to go, comfortably ensconced in The Encore at The Wynn. The conference and...
Read More >>
FEATURED PRODUCTS
