Installed capacity for 300mm wafer processing to rise to 70% of total capacity by 2017


Capacity for 200mm wafers forecast to slip more than 10 points during same period.

Bosch and STM tie for No. 1 MEMS supplier of 2012

07/01/2013 For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelect...

MEMS for mobile industry will reach $6.4B by 2018


Market demand for new sensors will lead to a $6.4B market by 2018.

Bosch and STM hold joint honors as No. 1 MEMS suppliers for 2012

06/11/2013 For the first time ever, no clear winner has emerged to claim top honors in the MEMS business for 2012, with Bosch of Germany and French-Italian STMicroelect...

Alchimer to collaborate with imec on advanced nano-interconnect technologies

06/11/2013 In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect d...


-SCHOTT offers wide product portfolio of glass wafers for semiconductor industry

ENP Newswire - 05 July 2013Release date- 04072013 - Mainz (Germany) & Tokyo (Japan) - The international technology company SCHOTT with its business unit ...

Melexis Introduces Next Generation Triaxis® Position Sensor with SAE J2716 SENT Protocol for Safety Critical Applications

Tessenderlo, Belgium – The SAE J2716 SENT (Single Edge Nibble Transmission) protocol serves safety critical, cost sensitive applications in the aut...

Manufacturing innovations in MEMs, LEDs, silicon photonics, and printed/flexible electronics

SAN FRANCISCO, USA: Recent advances in microelectronics technology and production processes have led to the rapid acceleration in MEMs and LED manufacturing,...

Latest Manufacturing Innovations in MEMs, LEDs, Silicon Photonics, and Printed/Flexible Electronics Featured at SEMICON West

The Semiconductor Equipment and Materials International issued the following news release:Recent advances in microelectronics technology and production proce...



Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner...
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Automated Test Creation for Mixed Signal IP using IJTAG

The creation of test patterns for mixed signal IP has been, to a large extent, a manual effort. To improve the process used to test, access, and co...


Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process s...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business developme...
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Innovation in Semiconductor Manufacturing Instrumentation

As the semiconductor industry moves toward smaller geometries, manufacturing processes are becoming more complex. In particular, they’re more demanding of al...
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