Qualtré appointed Mark Laich as VP of sales and business development, responsible for customer and partner development as Qualtré launches its latest iteration of inertial sensing technologies.

Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.

Image Sensors 2012, March 20-22 in London, will highlight the emergence of CMOS image sensors against those based on TFTs, applications possibilities for 3D cameras and non-visual spectrum cameras, and more.

Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

Researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply, to aid advances in biomedicine, robotics and tunable micro-optics.

MEMSCAP (Paris:MEMS), provider of MEMS based products, topped 1 million units shipped of its Thermally Actuated Variable Optical Attenuator chips.

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.

AEPI and CEA-Leti will co-host a site visit to CEA-Leti and other facilities on the MINATEC campus, Grenoble, following MEMS Executive Congress Europe on March 23.

New MEMS thermopile players and applications are boosting market growth for infrared (IR) detectors, finds Yole Développement.

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.

Tessera Technologies Inc. (NASDAQ:TSRA), through its wholly owned subsidiary, DigitalOptics Corporation (DOC) will acquire certain assets of Vista Point Technologies, a Tier-One-qualified camera module manufacturing business of Flextronics.

After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.

Gyroscopes generated more revenues in 2011 than any other consumer/mobile MEMS, the first time gyroscopes topped accelerometers, reports IHS.

Jay Esfandyari, Fabio Pasolini, Gang Xu, STMicroelectronics, Coppell, TX

The Semiconductor Industry Association (SIA) released the 2011 International Technology Roadmap for Semiconductors (ITRS), a roadmap of near-term and long-term challenges and innovations for the semiconductor design and manufacturing industry through 2026.

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.

MIT researchers have come up with a new approach to MEMS design that enables engineers to design 3D configurations using existing fabrication processes. They built a MEMS device that enables 3D sensing on a single chip.

Xsens introduced a suite of sensor fusion software for smartphones, media tablets and other mobile devices.