More Materials and Equipment Articles

Europe to unite research efforts in Silicon Europe cluster alliance

Oct 8, 2012

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

Tessera to CEO: Spin off a business by 2015, vest $7.5M shares

Oct 5, 2012

Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.

Analyst: Fab spending softness 2012 extending into 2013

Oct 4, 2012

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

Applied Materials cutting 1300 jobs, reallocating funds to "key growth initiatives"

Oct 4, 2012

Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."

Japan's semiconductor industry: Fabs, equipment, and materials

Oct 3, 2012

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.

Development of a CMP pad using an unpatterned surface inspection system

Oct 1, 2012

Wafer haze information was used to develop an advanced Cu CMP processes. C. Y. Cheng, S. N. Peng, S.C. Chen, Semiconductor Technologies, Dow Electronic Materials, Dow Chemical Company, Miaoli, Taiwan Larry Yang, Debbie Hu, Steve Lin, KLA-Tencor Corp., Milpitas, CA, USA

A review of retention efficiency measurement techniques for sub-30nm liquid filtration

Oct 1, 2012

A new method based on fluorescent quantum dots was used to measure pore size. Suwen Liu, Haizheng Zhang, Jennifer Braggin, Entegris Inc., Billerica, MA, USA

LED makers urge DoE for more support

Oct 1, 2012 A delegation of stakeholders in LED manufacturing have met with US Department of Energy officials to plead their case for increased support in solid-state lighting (SSL) R&D and manufacturing, with the key message that SSL offers greater energy conservation and return-on-investments (ROI) tha...

A review of recent advances in electronic devices

Oct 1, 2012

Highlights from recent and upcoming conferences point to a bright future for traditional and emerging electronics, from transistors to memory, from flexible circuits to 3D. Pete Singer, Editor-in-Chief

EV Group sells first ZoneBOND tech for compound semi work

Sep 26, 2012

EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.

Chip demand still sliding, hopes for soft 3Q landing and recovery

Sep 21, 2012

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.

SPTS unveils low-temp PECVD cluster tool for 3D ICs

Sep 19, 2012

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.

IBM demos high-performance CMOS on flexible plastic substrates

Sep 17, 2012

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

IEDM unveils 2012 program highlights

Sep 17, 2012

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

A*STAR and Hitachi to collaborate on 3D ICs

Sep 13, 2012

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.

EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

Sep 10, 2012

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).

Ultra Tec adds endpoint detection module for chip package sampling

Sep 4, 2012

Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.

FormFactor to acquire Microprobe, creates top probe card supplier

Sep 4, 2012

Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.

A new era for equipment suppliers

Sep 1, 2012

The semiconductor equipment industry received quite a jolt recently.

Bruker lands order for multiple 3D optical microscopes

Aug 30, 2012

Bruker said that a leading semiconductor supplier purchased multiple ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs. 

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