Leti and EV Group launch a common lab on wafer bonding technologies


Project targets more efficient 3D TSV integration and covalent bonding at room temperature

New methods to reduce time and cost of R&D;


SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.

SEMICON West keynoter outlines The Big Five Challenges of the semiconductor industry

07/09/2013 When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to sugg...

SEMI announces board elections and leadership appointments


SEMI today announced the results of its annual Board of Directors elections.

SEMI sees 21% increase in chip equipment spending for 2014


SEMI forecasts semiconductor equipment sales will reach $43.98 billion in 2014, a 21 percent increase over estimated 2013 equipment spending.

Leti’s IDEAL and IMAGINE programs extend 193i immersion lithography for 1x nodes


CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

Element Six increases global manufacturing capacity for microwave CVD synthetic diamond


At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.


ROHM Semiconductor and Avnet Internix collaborate on a power supply module board

India, JULY 10 -- Avnet Internix, a subsidiary of Avnet's global Electronics Marketing group and ROHM Semiconductor (ROHM)...

Cadence Solutions Enable Successful Tape Out of 20-Nanometer SoC Test Chip by Global Unichip Corporation

SAN JOSE, CA--(Marketwired - July 9, 2013) - Cadence Design Systems (NASDAQ: CDNS), a leader in global electronic design ...

The Quartz Corp Demos at Intersolar USA

The Quartz Corp, a supplier of High Purity Quartz sand, reported it is exhibiting at Intersolar USA this July.According to...

Plessey's bright ideas land deal with US firm

MANUFACTURER Plessey Semiconductors has signed a global distribution deal with US firm Mouser Electronics which will help ...

Laser guided codes advance single pixel terahertz imaging

The universe is awash in terahertz (THz) waves, as harmless as they are abundant. But unlike other regions of the electrom...

Global Plastics Leader Brings Revolutionary Semiconductor Material Technologies to Semicon West 2013

READING, PA--(Marketwired - July 9, 2013) - Quadrant Engineering Plastic Products(EPP), the global leader of machinable p...



Rapid Defect Indentification with Layout-Aware Diagnosis

Scan logic diagnosis is a powerful tool to help failure analysis engineers determine the root cause of a failing die. Yield engineers, on the other hand, are...

Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent...
Sponsored by


Surface Cleaning and Preparation

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL...

450mm Status Report

Hear from the G450C General Manager, Paul Farrar Jr., on the current status of activities, key milestones and schedules, and imec’s senior business...
Sponsored by




2nd World Congress on Integrated Computational Materials Engineering

Salt Lake City, UT


San Francisco, California
July 9, 2013 - July 11, 2013

The 8th Pacific Rim International Conference on Advanced Materials and Processing

Waikoloa, HI

2013 International Siberian Conference on Control and Communications (SIBCON 2013)

Tomsk, Russia , Russia
September 12, 2013 - September 13, 2013

2013 IEEE Custom Integrated Circuits Conference (CICC 2013)

San Jose, California , United States
+1 301 527 0900
+1 301 527 0994
September 22, 2013 - September 25, 2013


ROFIN presents turnkey solutions for FEOL applications

July 2, 2013 The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading ...

EV Group launches new LowTemp room temperature debonding platform

July 1, 2013 EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today i...

All-in-one microscope for advanced imaging, recording and measurement

June 7, 2013

Building on its extensive microscope lineup, KEYENCE Corporation has released a new multipurpose microscope.

Olympus launches LEXT OLS4100 laser confocal microscope

June 7, 2013

New 3D measuring system offers auto brightness and high-speed stitching.


© 2013. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS