Semiconductor yield at 450mm: Solid State Technology March 2012 issue preview

Fri, Feb 10, 2012

The March 2012 issue of Solid State Technology will feature "450mm wafer transition" from Dr. Brian Trafas, chief marketing officer at KLA-Tencor. The following is a sneak preview of Dr. Trafas' article.

IC industry headed for 7% growth in 2012; 11 of 33 categories will outperform

Fri, Feb 10, 2012

IC Insights forecasts 7% growth for the total IC industry in 2012. 27 of the 33 major IC product categories will experience growth in 2012. 11 will grow faster than 7%. 6 will show double-digit growth.

Demonstration of the ability to repair a 200nm gap in the pre-pattern. Imec's DSA technology.

imec achieves 300mm wafer-fab-compatible directed self assembly

Fri, Feb 10, 2012

imec successfully implemented a 300mm directed self-assembly (DSA) semiconductor manufacturing process line in its fab, with TEL equipment, AZ Electronic Materials consummables, and research from the University of Wisconsin.

b) Diagram of a basic unit cell of a FinFET, demonstrating twelve important process control parameters.

Semiconductor metrology beyond 22nm: FinFET metrology

Thu, Feb 9, 2012 SEMATECH authors discuss semiconductor metrology solutions currently being investigated to address the challenges of future nodes. FinFETs raise new metrology complexities, as the entire 3D structure becomes critical for process control, including fin and gate dimensions, profiles and roughness, ...

Georgia Institute of Technology, PARC + Thin Film Electronics, Western Michigan University win FLEXIs for flexible electronics advances

Thu, Feb 9, 2012

FlexTech Alliance awarded its 2012 FLEXI Awards for flexible, printed electronics and displays industry to PARC and Thin Film Electronics, Western Michigan University, and the Georgia Institute of Technology.

Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

Thu, Feb 9, 2012

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.


2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

Wed, Feb 8, 2012

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

Compound semiconductor makers focus on growing high-frequency market

Wed, Feb 8, 2012

Handset products dominate compound semiconductor revenue, but microelectronics companies focus development on high-performance, high-frequency applications where volumes are lower and products are differentiated by performance, reports Strategy Analytics.

2011 semiconductor revenues, SIA.

UPDATED: Record semiconductor sales in 2011, 2012 outlook

Wed, Feb 8, 2012

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.

JPSA expands Ultrafast laser machining technology

Wed, Feb 8, 2012

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.

Novellus' VECTOR Strata dielectric deposition tool for high-volume manufacturing of vertically integrated memory (VIM) Flash devices

Novellus film deposition tool suits 3D Flash device fab

Tue, Feb 7, 2012 Novellus debuted the VECTOR Strata dielectric deposition tool for high-volume VIM Flash manufacturing. VECTOR Strata aims for ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure.

Semiconductors to use most ultrapure water in 2012

Tue, Feb 7, 2012

The electronics industry will edge out coal-fired boilers as the biggest purchaser of ultrapure water systems and consumables in 2012, according to the McIlvaine report: Ultrapure Water World Markets.

EV Group's EVG620HBL Gen II fully automated lithography mask alignment system.

EVG LED mask aligner offers COO improvement in gen-2

Tue, Feb 7, 2012

EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.

Silicon wafer revenues increased, shipments tapered in 2011

Tue, Feb 7, 2012

Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.


SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

Tue, Feb 7, 2012

Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.

Gigaphoton launches ArF excimer laser for multi-patterning immersion lithography

Mon, Feb 6, 2012

Gigaphoton uncrated the GT63A next-generation ArF excimer laser for multi-patterning immersion lithography scanners.

Rudolph Technologies' MetaPULSE metrology tool for advanced packaging processes.

Rudolph sells metrology tool for back-end wafer packaging processes

Mon, Feb 6, 2012

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.

Steve Appleton, CEO of Micron, passed away.

Micron (MU) CEO dies unexpectedly; company shares succession plan

Mon, Feb 6, 2012

Micron Technology Inc. (Nasdaq:MU) long-time CEO and chairman Steve Appleton passed away. MU named Mark Durcan, Micron president and COO, to fill the vacant CEO post, and serve on the Board.

Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev

Fri, Feb 3, 2012

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.

X-FAB Silicon Foundries adopts SFT software

Fri, Feb 3, 2012

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18µm high-voltage process (XH018), providing improvements in reliability and efficiency.


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